Menetelmä ohutkalvoaurinkokennojen integroidun laserstrukturoinnin tekemiseksi
In order to structure thin film solar cells with a transparent substrate and a transparent front electrode, the active semiconductor layer and the backing electrode are lifted off in a single step to produce the required structure pits. For that purpose, the energy required is irradiated by laser pu...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | fin ; swe |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | KARG,FRANZ RIEDL,WOLFGANG EINZINGER,RICHARD AULICH,HUBERT |
description | In order to structure thin film solar cells with a transparent substrate and a transparent front electrode, the active semiconductor layer and the backing electrode are lifted off in a single step to produce the required structure pits. For that purpose, the energy required is irradiated by laser pulses through the substrate and the front electrode into the semiconductor material. The semiconductor material is thus blasted off the front electrode in the irradiated area without leaving any residues. In order to wire adjacent solar cell strips, the strips are further irradiated directly next to the generated structure pits. By reversing the phase of the semiconductor layer, low impedance areas are generated that connect the backing electrode of a first strip-shaped solar cell to the front electrode of a second strip-shaped solar cell. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_FI117608BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>FI117608BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_FI117608BB3</originalsourceid><addsrcrecordid>eNrjZPD3Tc1LLUnNyT28RCE_o7QkOzGnLD-xtCgzLzs_OzUvLz8rNU8hM68kNb0oPzOlNE8hJ7E4tai4pKg0u6QUKJSXl5mnUJKanZqbWZyaXZzJw8CalphTnMoLpbkZ5N1cQ5w9dFML8uNTiwsSk0H2xbt5GhqamxlYODkZE1YBAA33OUo</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Menetelmä ohutkalvoaurinkokennojen integroidun laserstrukturoinnin tekemiseksi</title><source>esp@cenet</source><creator>KARG,FRANZ ; RIEDL,WOLFGANG ; EINZINGER,RICHARD ; AULICH,HUBERT</creator><creatorcontrib>KARG,FRANZ ; RIEDL,WOLFGANG ; EINZINGER,RICHARD ; AULICH,HUBERT</creatorcontrib><description>In order to structure thin film solar cells with a transparent substrate and a transparent front electrode, the active semiconductor layer and the backing electrode are lifted off in a single step to produce the required structure pits. For that purpose, the energy required is irradiated by laser pulses through the substrate and the front electrode into the semiconductor material. The semiconductor material is thus blasted off the front electrode in the irradiated area without leaving any residues. In order to wire adjacent solar cell strips, the strips are further irradiated directly next to the generated structure pits. By reversing the phase of the semiconductor layer, low impedance areas are generated that connect the backing electrode of a first strip-shaped solar cell to the front electrode of a second strip-shaped solar cell.</description><language>fin ; swe</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061215&DB=EPODOC&CC=FI&NR=117608B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25566,76549</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061215&DB=EPODOC&CC=FI&NR=117608B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KARG,FRANZ</creatorcontrib><creatorcontrib>RIEDL,WOLFGANG</creatorcontrib><creatorcontrib>EINZINGER,RICHARD</creatorcontrib><creatorcontrib>AULICH,HUBERT</creatorcontrib><title>Menetelmä ohutkalvoaurinkokennojen integroidun laserstrukturoinnin tekemiseksi</title><description>In order to structure thin film solar cells with a transparent substrate and a transparent front electrode, the active semiconductor layer and the backing electrode are lifted off in a single step to produce the required structure pits. For that purpose, the energy required is irradiated by laser pulses through the substrate and the front electrode into the semiconductor material. The semiconductor material is thus blasted off the front electrode in the irradiated area without leaving any residues. In order to wire adjacent solar cell strips, the strips are further irradiated directly next to the generated structure pits. By reversing the phase of the semiconductor layer, low impedance areas are generated that connect the backing electrode of a first strip-shaped solar cell to the front electrode of a second strip-shaped solar cell.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPD3Tc1LLUnNyT28RCE_o7QkOzGnLD-xtCgzLzs_OzUvLz8rNU8hM68kNb0oPzOlNE8hJ7E4tai4pKg0u6QUKJSXl5mnUJKanZqbWZyaXZzJw8CalphTnMoLpbkZ5N1cQ5w9dFML8uNTiwsSk0H2xbt5GhqamxlYODkZE1YBAA33OUo</recordid><startdate>20061215</startdate><enddate>20061215</enddate><creator>KARG,FRANZ</creator><creator>RIEDL,WOLFGANG</creator><creator>EINZINGER,RICHARD</creator><creator>AULICH,HUBERT</creator><scope>EVB</scope></search><sort><creationdate>20061215</creationdate><title>Menetelmä ohutkalvoaurinkokennojen integroidun laserstrukturoinnin tekemiseksi</title><author>KARG,FRANZ ; RIEDL,WOLFGANG ; EINZINGER,RICHARD ; AULICH,HUBERT</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_FI117608BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>fin ; swe</language><creationdate>2006</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>KARG,FRANZ</creatorcontrib><creatorcontrib>RIEDL,WOLFGANG</creatorcontrib><creatorcontrib>EINZINGER,RICHARD</creatorcontrib><creatorcontrib>AULICH,HUBERT</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KARG,FRANZ</au><au>RIEDL,WOLFGANG</au><au>EINZINGER,RICHARD</au><au>AULICH,HUBERT</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Menetelmä ohutkalvoaurinkokennojen integroidun laserstrukturoinnin tekemiseksi</title><date>2006-12-15</date><risdate>2006</risdate><abstract>In order to structure thin film solar cells with a transparent substrate and a transparent front electrode, the active semiconductor layer and the backing electrode are lifted off in a single step to produce the required structure pits. For that purpose, the energy required is irradiated by laser pulses through the substrate and the front electrode into the semiconductor material. The semiconductor material is thus blasted off the front electrode in the irradiated area without leaving any residues. In order to wire adjacent solar cell strips, the strips are further irradiated directly next to the generated structure pits. By reversing the phase of the semiconductor layer, low impedance areas are generated that connect the backing electrode of a first strip-shaped solar cell to the front electrode of a second strip-shaped solar cell.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | fin ; swe |
recordid | cdi_epo_espacenet_FI117608BB |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE TRANSPORTING WELDING WORKING BY LASER BEAM |
title | Menetelmä ohutkalvoaurinkokennojen integroidun laserstrukturoinnin tekemiseksi |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-17T23%3A05%3A26IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KARG,FRANZ&rft.date=2006-12-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EFI117608BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |