Formulación de adhesivo de unión con baja energía superficial y proceso para el uso de la misma
Una formulación de adhesivo de dos partes que comprende: una parte de adhesivo que comprende: una cantidad de monómeros curables por radicales libres, conteniendo cada uno de dichos monómeros al menos un resto acrilato o al menos un resto metacrilato; una cantidad de un polímero clorosulfonado; una...
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| creator | KOSHTI, Prashant DOE, Dan DESHPANDE, Subodh SHUKLA, Brajesh CARBUTT, Peter |
| description | Una formulación de adhesivo de dos partes que comprende: una parte de adhesivo que comprende: una cantidad de monómeros curables por radicales libres, conteniendo cada uno de dichos monómeros al menos un resto acrilato o al menos un resto metacrilato; una cantidad de un polímero clorosulfonado; una cantidad de elastómero; un ácido de Lewis; una cantidad de un monómero polifuncional que es monómero de dimetacrilato, monómero de trimetacrilato o una combinación de los mismos; y una parte de activador presente en una razón en peso de 1:1 de dicha parte de adhesivo:dicha parte de activador, comprendiendo dicha parte de activador: un complejo de borano-amina; y un aditivo termoplástico/de elastómero injertado.
An adhesive two-part formulation is provided that includes an amount of free-radical curable monomers, each of said monomers containing at least one acrylate moiety. Also preset in the formulation is an amount of a chlorosulfonated polymer; a Lewis acid; a polyfunctional monomer amount of dimethacrylate monomer, trimethacrylate monomer, an elastomer, a thermoplastic additive, or a combination thereof. A borane-amine complex is provided as an activator. A process of applying the formulation to a substrate includes mixing together the formulation components such that each part has a storage stability at 50° C. for 30 days where the viscosity at 30 days is within 40% of an initial viscosity. The mixture is applied to the substrate and then allowed to cure to achieve an initial strength of at least 345 kiloPascals (kPa) within 30 minutes and 40 minutes for adhesive:activator weight ratio of 1:1 and 10:1, respectively. |
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An adhesive two-part formulation is provided that includes an amount of free-radical curable monomers, each of said monomers containing at least one acrylate moiety. Also preset in the formulation is an amount of a chlorosulfonated polymer; a Lewis acid; a polyfunctional monomer amount of dimethacrylate monomer, trimethacrylate monomer, an elastomer, a thermoplastic additive, or a combination thereof. A borane-amine complex is provided as an activator. A process of applying the formulation to a substrate includes mixing together the formulation components such that each part has a storage stability at 50° C. for 30 days where the viscosity at 30 days is within 40% of an initial viscosity. The mixture is applied to the substrate and then allowed to cure to achieve an initial strength of at least 345 kiloPascals (kPa) within 30 minutes and 40 minutes for adhesive:activator weight ratio of 1:1 and 10:1, respectively.</description><language>spa</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200207&DB=EPODOC&CC=ES&NR=2741000T3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200207&DB=EPODOC&CC=ES&NR=2741000T3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOSHTI, Prashant</creatorcontrib><creatorcontrib>DOE, Dan</creatorcontrib><creatorcontrib>DESHPANDE, Subodh</creatorcontrib><creatorcontrib>SHUKLA, Brajesh</creatorcontrib><creatorcontrib>CARBUTT, Peter</creatorcontrib><title>Formulación de adhesivo de unión con baja energía superficial y proceso para el uso de la misma</title><description>Una formulación de adhesivo de dos partes que comprende: una parte de adhesivo que comprende: una cantidad de monómeros curables por radicales libres, conteniendo cada uno de dichos monómeros al menos un resto acrilato o al menos un resto metacrilato; una cantidad de un polímero clorosulfonado; una cantidad de elastómero; un ácido de Lewis; una cantidad de un monómero polifuncional que es monómero de dimetacrilato, monómero de trimetacrilato o una combinación de los mismos; y una parte de activador presente en una razón en peso de 1:1 de dicha parte de adhesivo:dicha parte de activador, comprendiendo dicha parte de activador: un complejo de borano-amina; y un aditivo termoplástico/de elastómero injertado.
An adhesive two-part formulation is provided that includes an amount of free-radical curable monomers, each of said monomers containing at least one acrylate moiety. Also preset in the formulation is an amount of a chlorosulfonated polymer; a Lewis acid; a polyfunctional monomer amount of dimethacrylate monomer, trimethacrylate monomer, an elastomer, a thermoplastic additive, or a combination thereof. A borane-amine complex is provided as an activator. A process of applying the formulation to a substrate includes mixing together the formulation components such that each part has a storage stability at 50° C. for 30 days where the viscosity at 30 days is within 40% of an initial viscosity. The mixture is applied to the substrate and then allowed to cure to achieve an initial strength of at least 345 kiloPascals (kPa) within 30 minutes and 40 minutes for adhesive:activator weight ratio of 1:1 and 10:1, respectively.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjEEKwjAQRbtxIeodxgMI0QoeQFrcm32ZplONJJmQMYKHcuURejFr8QCu_uPz_p8Xbc3JZ4fGDu8AHQF2VxL74C_nMLWGA7R4Q6BA6TK8ECRHSr01Fh08ISY2JAwR0-g4yDKtHYK34nFZzHp0QqtfLop1XenjaUORG5KIZvy9N9V5d9hvlVJal-U_zgchwT92</recordid><startdate>20200207</startdate><enddate>20200207</enddate><creator>KOSHTI, Prashant</creator><creator>DOE, Dan</creator><creator>DESHPANDE, Subodh</creator><creator>SHUKLA, Brajesh</creator><creator>CARBUTT, Peter</creator><scope>EVB</scope></search><sort><creationdate>20200207</creationdate><title>Formulación de adhesivo de unión con baja energía superficial y proceso para el uso de la misma</title><author>KOSHTI, Prashant ; DOE, Dan ; DESHPANDE, Subodh ; SHUKLA, Brajesh ; CARBUTT, Peter</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_ES2741000TT33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>spa</language><creationdate>2020</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>KOSHTI, Prashant</creatorcontrib><creatorcontrib>DOE, Dan</creatorcontrib><creatorcontrib>DESHPANDE, Subodh</creatorcontrib><creatorcontrib>SHUKLA, Brajesh</creatorcontrib><creatorcontrib>CARBUTT, Peter</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOSHTI, Prashant</au><au>DOE, Dan</au><au>DESHPANDE, Subodh</au><au>SHUKLA, Brajesh</au><au>CARBUTT, Peter</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Formulación de adhesivo de unión con baja energía superficial y proceso para el uso de la misma</title><date>2020-02-07</date><risdate>2020</risdate><abstract>Una formulación de adhesivo de dos partes que comprende: una parte de adhesivo que comprende: una cantidad de monómeros curables por radicales libres, conteniendo cada uno de dichos monómeros al menos un resto acrilato o al menos un resto metacrilato; una cantidad de un polímero clorosulfonado; una cantidad de elastómero; un ácido de Lewis; una cantidad de un monómero polifuncional que es monómero de dimetacrilato, monómero de trimetacrilato o una combinación de los mismos; y una parte de activador presente en una razón en peso de 1:1 de dicha parte de adhesivo:dicha parte de activador, comprendiendo dicha parte de activador: un complejo de borano-amina; y un aditivo termoplástico/de elastómero injertado.
An adhesive two-part formulation is provided that includes an amount of free-radical curable monomers, each of said monomers containing at least one acrylate moiety. Also preset in the formulation is an amount of a chlorosulfonated polymer; a Lewis acid; a polyfunctional monomer amount of dimethacrylate monomer, trimethacrylate monomer, an elastomer, a thermoplastic additive, or a combination thereof. A borane-amine complex is provided as an activator. A process of applying the formulation to a substrate includes mixing together the formulation components such that each part has a storage stability at 50° C. for 30 days where the viscosity at 30 days is within 40% of an initial viscosity. The mixture is applied to the substrate and then allowed to cure to achieve an initial strength of at least 345 kiloPascals (kPa) within 30 minutes and 40 minutes for adhesive:activator weight ratio of 1:1 and 10:1, respectively.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES |
| title | Formulación de adhesivo de unión con baja energía superficial y proceso para el uso de la misma |
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