FORMULACION DE RESINA DE IMPREGNACION
Formulación de resina de impregnación de baja viscosidad que contiene un componente A que contiene una resina de poliéster insaturado que contiene éter alílico, un componente B que contiene una resina de poliéster insaturado distinta del componente A terminada en diciclopentadieno, un componente C q...
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| creator | TODTER-KONIG, SASCHA HEGEMANN, GUNTER ABENDROTH, MARK LIENERT, KLAUS-W |
| description | Formulación de resina de impregnación de baja viscosidad que contiene un componente A que contiene una resina de poliéster insaturado que contiene éter alílico, un componente B que contiene una resina de poliéster insaturado distinta del componente A terminada en diciclopentadieno, un componente C que contiene otro polímero insaturado distinto de las resinas de poliéster según los componentes A y B, así como dado el caso endurecedores, aceleradores, estabilizadores, aditivos y aditivos reológicos, presentando la formulación de resina de impregnación una viscosidad inferior o igual a 1500 mPas medida a 25ºC.
The invention relates to an impregnating resin formulation containing a component A which contains an unsaturated polyester resin comprising allyethers, a component B which contains dicyclopentadiene terminated, unsaturated polyester resin which is different from the component A, a component C which contains an additional unsaturated polymer which is different from polyester resins of components A and B, and, optionally, hardeners, accelerators, stabilizers, additives and rheology additives. Said invention also relates to the use thereof in order to impregnate windings for the production of base materials of flat isolating material and in order to cover printed circuit boards. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_ES2320786TT3</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>ES2320786TT3</sourcerecordid><originalsourceid>FETCH-epo_espacenet_ES2320786TT33</originalsourceid><addsrcrecordid>eNrjZFB18w_yDfVxdPb091NwcVUIcg329HMEsTx9A4Jc3f3AMjwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4IDE5NS-1JN412MjYyMDcwiwkxNiYGDUAmlojlQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FORMULACION DE RESINA DE IMPREGNACION</title><source>esp@cenet</source><creator>TODTER-KONIG, SASCHA ; HEGEMANN, GUNTER ; ABENDROTH, MARK ; LIENERT, KLAUS-W</creator><creatorcontrib>TODTER-KONIG, SASCHA ; HEGEMANN, GUNTER ; ABENDROTH, MARK ; LIENERT, KLAUS-W</creatorcontrib><description>Formulación de resina de impregnación de baja viscosidad que contiene un componente A que contiene una resina de poliéster insaturado que contiene éter alílico, un componente B que contiene una resina de poliéster insaturado distinta del componente A terminada en diciclopentadieno, un componente C que contiene otro polímero insaturado distinto de las resinas de poliéster según los componentes A y B, así como dado el caso endurecedores, aceleradores, estabilizadores, aditivos y aditivos reológicos, presentando la formulación de resina de impregnación una viscosidad inferior o igual a 1500 mPas medida a 25ºC.
The invention relates to an impregnating resin formulation containing a component A which contains an unsaturated polyester resin comprising allyethers, a component B which contains dicyclopentadiene terminated, unsaturated polyester resin which is different from the component A, a component C which contains an additional unsaturated polymer which is different from polyester resins of components A and B, and, optionally, hardeners, accelerators, stabilizers, additives and rheology additives. Said invention also relates to the use thereof in order to impregnate windings for the production of base materials of flat isolating material and in order to cover printed circuit boards.</description><language>spa</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CONDUCTORS ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; CORRECTING FLUIDS ; DYES ; DYNAMO-ELECTRIC MACHINES ; ELECTRICITY ; FILLING PASTES ; GENERATION ; INKS ; INSULATORS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090528&DB=EPODOC&CC=ES&NR=2320786T3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090528&DB=EPODOC&CC=ES&NR=2320786T3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TODTER-KONIG, SASCHA</creatorcontrib><creatorcontrib>HEGEMANN, GUNTER</creatorcontrib><creatorcontrib>ABENDROTH, MARK</creatorcontrib><creatorcontrib>LIENERT, KLAUS-W</creatorcontrib><title>FORMULACION DE RESINA DE IMPREGNACION</title><description>Formulación de resina de impregnación de baja viscosidad que contiene un componente A que contiene una resina de poliéster insaturado que contiene éter alílico, un componente B que contiene una resina de poliéster insaturado distinta del componente A terminada en diciclopentadieno, un componente C que contiene otro polímero insaturado distinto de las resinas de poliéster según los componentes A y B, así como dado el caso endurecedores, aceleradores, estabilizadores, aditivos y aditivos reológicos, presentando la formulación de resina de impregnación una viscosidad inferior o igual a 1500 mPas medida a 25ºC.
The invention relates to an impregnating resin formulation containing a component A which contains an unsaturated polyester resin comprising allyethers, a component B which contains dicyclopentadiene terminated, unsaturated polyester resin which is different from the component A, a component C which contains an additional unsaturated polymer which is different from polyester resins of components A and B, and, optionally, hardeners, accelerators, stabilizers, additives and rheology additives. Said invention also relates to the use thereof in order to impregnate windings for the production of base materials of flat isolating material and in order to cover printed circuit boards.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>CONDUCTORS</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>DYNAMO-ELECTRIC MACHINES</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>GENERATION</subject><subject>INKS</subject><subject>INSULATORS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB18w_yDfVxdPb091NwcVUIcg329HMEsTx9A4Jc3f3AMjwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4IDE5NS-1JN412MjYyMDcwiwkxNiYGDUAmlojlQ</recordid><startdate>20090528</startdate><enddate>20090528</enddate><creator>TODTER-KONIG, SASCHA</creator><creator>HEGEMANN, GUNTER</creator><creator>ABENDROTH, MARK</creator><creator>LIENERT, KLAUS-W</creator><scope>EVB</scope></search><sort><creationdate>20090528</creationdate><title>FORMULACION DE RESINA DE IMPREGNACION</title><author>TODTER-KONIG, SASCHA ; HEGEMANN, GUNTER ; ABENDROTH, MARK ; LIENERT, KLAUS-W</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_ES2320786TT33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>spa</language><creationdate>2009</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>CONDUCTORS</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>DYNAMO-ELECTRIC MACHINES</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>GENERATION</topic><topic>INKS</topic><topic>INSULATORS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>TODTER-KONIG, SASCHA</creatorcontrib><creatorcontrib>HEGEMANN, GUNTER</creatorcontrib><creatorcontrib>ABENDROTH, MARK</creatorcontrib><creatorcontrib>LIENERT, KLAUS-W</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TODTER-KONIG, SASCHA</au><au>HEGEMANN, GUNTER</au><au>ABENDROTH, MARK</au><au>LIENERT, KLAUS-W</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FORMULACION DE RESINA DE IMPREGNACION</title><date>2009-05-28</date><risdate>2009</risdate><abstract>Formulación de resina de impregnación de baja viscosidad que contiene un componente A que contiene una resina de poliéster insaturado que contiene éter alílico, un componente B que contiene una resina de poliéster insaturado distinta del componente A terminada en diciclopentadieno, un componente C que contiene otro polímero insaturado distinto de las resinas de poliéster según los componentes A y B, así como dado el caso endurecedores, aceleradores, estabilizadores, aditivos y aditivos reológicos, presentando la formulación de resina de impregnación una viscosidad inferior o igual a 1500 mPas medida a 25ºC.
The invention relates to an impregnating resin formulation containing a component A which contains an unsaturated polyester resin comprising allyethers, a component B which contains dicyclopentadiene terminated, unsaturated polyester resin which is different from the component A, a component C which contains an additional unsaturated polymer which is different from polyester resins of components A and B, and, optionally, hardeners, accelerators, stabilizers, additives and rheology additives. Said invention also relates to the use thereof in order to impregnate windings for the production of base materials of flat isolating material and in order to cover printed circuit boards.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER CORRECTING FLUIDS DYES DYNAMO-ELECTRIC MACHINES ELECTRICITY FILLING PASTES GENERATION INKS INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS |
| title | FORMULACION DE RESINA DE IMPREGNACION |
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