PRODUCTOS DE IMPREGNACION, SELLADO Y REVESTIMIENTO PARA COMPONENTES ELECTROTECNICOS Y/O ELECTRONICOS Y PARA MATERIALES DE SOPORTE EN MATERIAS AISLANTES PLANAS
La invención se refiere al uso de una resina (A) como compuesto de impregnación, moldeo y revestimiento para componentes electrotécnico y/o electrónicos y para materiales soporte de materiales aislantes planos. La resina (A) contiene: A1) al menos una resina de poliéster insaturado; A2) al menos un...
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| creator | HEGEMANN, GUNTER BLUM, RAINER LIENERT, KLAUS-WILHELM EICHHORST, MANFRED |
| description | La invención se refiere al uso de una resina (A) como compuesto de impregnación, moldeo y revestimiento para componentes electrotécnico y/o electrónicos y para materiales soporte de materiales aislantes planos. La resina (A) contiene: A1) al menos una resina de poliéster insaturado; A2) al menos un éter de vinilo con una viscosidad de menos de 400 mPa.s a 25ºC; A3) opcionalmente al menos otro polímero y/o oligómero; A4) opcionalmente al menos un acelerador del endurecimiento; A5) opcionalmente al menos un reactivo diluyente etilénicamente insaturado y A6) opcionalmente otros aditivos convencionales. La invención también se refiere a compuestos de revestimiento que se endurecen a baja emisión y son adecuados para este propósito.
The subject of the present invention is the use of a resin composition (A) comprisingA1) at least one unsaturated polyester resin,A2) at least one vinyl ether having a viscosity of less than 4000 mPa.s at 25° C.,A3) if desired, at least one further polymer and/or oligomer,A4) if desired, at least one curing accelerator,A5) if desired, at least one ethylenically unsaturated reactive diluent, andA6) if desired, further customary additives,as impregnating, casting and coating compositions for electrical and/or electronic components and for carrier materials for sheetlike insulating materials.The present invention additionally relates to coating compositions suitable for this purpose which can be cured with low emissions. |
| format | Patent |
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The subject of the present invention is the use of a resin composition (A) comprisingA1) at least one unsaturated polyester resin,A2) at least one vinyl ether having a viscosity of less than 4000 mPa.s at 25° C.,A3) if desired, at least one further polymer and/or oligomer,A4) if desired, at least one curing accelerator,A5) if desired, at least one ethylenically unsaturated reactive diluent, andA6) if desired, further customary additives,as impregnating, casting and coating compositions for electrical and/or electronic components and for carrier materials for sheetlike insulating materials.The present invention additionally relates to coating compositions suitable for this purpose which can be cured with low emissions.</description><edition>7</edition><language>spa</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CONDUCTORS ; CORRECTING FLUIDS ; DYES ; ELECTRICITY ; FILLING PASTES ; INKS ; INSULATORS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041216&DB=EPODOC&CC=ES&NR=2221165T3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041216&DB=EPODOC&CC=ES&NR=2221165T3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HEGEMANN, GUNTER</creatorcontrib><creatorcontrib>BLUM, RAINER</creatorcontrib><creatorcontrib>LIENERT, KLAUS-WILHELM</creatorcontrib><creatorcontrib>EICHHORST, MANFRED</creatorcontrib><title>PRODUCTOS DE IMPREGNACION, SELLADO Y REVESTIMIENTO PARA COMPONENTES ELECTROTECNICOS Y/O ELECTRONICOS Y PARA MATERIALES DE SOPORTE EN MATERIAS AISLANTES PLANAS</title><description>La invención se refiere al uso de una resina (A) como compuesto de impregnación, moldeo y revestimiento para componentes electrotécnico y/o electrónicos y para materiales soporte de materiales aislantes planos. La resina (A) contiene: A1) al menos una resina de poliéster insaturado; A2) al menos un éter de vinilo con una viscosidad de menos de 400 mPa.s a 25ºC; A3) opcionalmente al menos otro polímero y/o oligómero; A4) opcionalmente al menos un acelerador del endurecimiento; A5) opcionalmente al menos un reactivo diluyente etilénicamente insaturado y A6) opcionalmente otros aditivos convencionales. La invención también se refiere a compuestos de revestimiento que se endurecen a baja emisión y son adecuados para este propósito.
The subject of the present invention is the use of a resin composition (A) comprisingA1) at least one unsaturated polyester resin,A2) at least one vinyl ether having a viscosity of less than 4000 mPa.s at 25° C.,A3) if desired, at least one further polymer and/or oligomer,A4) if desired, at least one curing accelerator,A5) if desired, at least one ethylenically unsaturated reactive diluent, andA6) if desired, further customary additives,as impregnating, casting and coating compositions for electrical and/or electronic components and for carrier materials for sheetlike insulating materials.The present invention additionally relates to coating compositions suitable for this purpose which can be cured with low emissions.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>CONDUCTORS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>INSULATORS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNTb0KwjAQ7uIg6jucuyK26H6kpwbSXMidQqciEidRoT6Pz2qpdnf6-P7H2TtELo9GWaAksFWItPdoLPsFCDmHJUMNkU4kaitLXhkCRgTDVWDfcRIgR0YjKxlvTbdUr3jQfsK3U6FStOioPxMOHJWA_GAIoBWH_WboEGWaja7nW5tmP5xk8x2pOSzT89Gk9nm-pHt6NSR5nq_X241qUfyT-QBE0EUn</recordid><startdate>20041216</startdate><enddate>20041216</enddate><creator>HEGEMANN, GUNTER</creator><creator>BLUM, RAINER</creator><creator>LIENERT, KLAUS-WILHELM</creator><creator>EICHHORST, MANFRED</creator><scope>EVB</scope></search><sort><creationdate>20041216</creationdate><title>PRODUCTOS DE IMPREGNACION, SELLADO Y REVESTIMIENTO PARA COMPONENTES ELECTROTECNICOS Y/O ELECTRONICOS Y PARA MATERIALES DE SOPORTE EN MATERIAS AISLANTES PLANAS</title><author>HEGEMANN, GUNTER ; BLUM, RAINER ; LIENERT, KLAUS-WILHELM ; EICHHORST, MANFRED</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_ES2221165TT33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>spa</language><creationdate>2004</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CAPACITORS</topic><topic>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>CONDUCTORS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>INSULATORS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>HEGEMANN, GUNTER</creatorcontrib><creatorcontrib>BLUM, RAINER</creatorcontrib><creatorcontrib>LIENERT, KLAUS-WILHELM</creatorcontrib><creatorcontrib>EICHHORST, MANFRED</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HEGEMANN, GUNTER</au><au>BLUM, RAINER</au><au>LIENERT, KLAUS-WILHELM</au><au>EICHHORST, MANFRED</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRODUCTOS DE IMPREGNACION, SELLADO Y REVESTIMIENTO PARA COMPONENTES ELECTROTECNICOS Y/O ELECTRONICOS Y PARA MATERIALES DE SOPORTE EN MATERIAS AISLANTES PLANAS</title><date>2004-12-16</date><risdate>2004</risdate><abstract>La invención se refiere al uso de una resina (A) como compuesto de impregnación, moldeo y revestimiento para componentes electrotécnico y/o electrónicos y para materiales soporte de materiales aislantes planos. La resina (A) contiene: A1) al menos una resina de poliéster insaturado; A2) al menos un éter de vinilo con una viscosidad de menos de 400 mPa.s a 25ºC; A3) opcionalmente al menos otro polímero y/o oligómero; A4) opcionalmente al menos un acelerador del endurecimiento; A5) opcionalmente al menos un reactivo diluyente etilénicamente insaturado y A6) opcionalmente otros aditivos convencionales. La invención también se refiere a compuestos de revestimiento que se endurecen a baja emisión y son adecuados para este propósito.
The subject of the present invention is the use of a resin composition (A) comprisingA1) at least one unsaturated polyester resin,A2) at least one vinyl ether having a viscosity of less than 4000 mPa.s at 25° C.,A3) if desired, at least one further polymer and/or oligomer,A4) if desired, at least one curing accelerator,A5) if desired, at least one ethylenically unsaturated reactive diluent, andA6) if desired, further customary additives,as impregnating, casting and coating compositions for electrical and/or electronic components and for carrier materials for sheetlike insulating materials.The present invention additionally relates to coating compositions suitable for this purpose which can be cured with low emissions.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS CORRECTING FLUIDS DYES ELECTRICITY FILLING PASTES INKS INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS THEREFOR WOODSTAINS |
| title | PRODUCTOS DE IMPREGNACION, SELLADO Y REVESTIMIENTO PARA COMPONENTES ELECTROTECNICOS Y/O ELECTRONICOS Y PARA MATERIALES DE SOPORTE EN MATERIAS AISLANTES PLANAS |
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