METODO PARA SOLDAR COMPONENTES ELECTRONICOS TIPO D-PAK A PLACAS DE CIRCUITO

Se describe en este documento un procedimiento para soldar un componente electrónico 10 que tiene un diseminador de calor 14 sobre una superficie de fondo del mismo y al menos un terminal 18 (por ejemplo, un componente del tipo DPAK) a un placa de circuito 30 que tiene una almohadilla de montaje del...

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Bibliographische Detailangaben

1. Verfasser:	SINKUNAS, PETER JOSEPH
Format:	Patent
Sprache:	spa
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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