VAPOR CHAMBER
In some aspects, a vapor chamber includes a sealed enclosure. The sealed enclosure includes: a main portion defining a main chamber and a duct portion. The main portion has a heat input surface region for contacting a heat source. The duct portion extends from a first margin region of the main porti...
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creator | WANG, Fumei CHENG, Chengyu HUNG, Yihsiang |
description | In some aspects, a vapor chamber includes a sealed enclosure. The sealed enclosure includes: a main portion defining a main chamber and a duct portion. The main portion has a heat input surface region for contacting a heat source. The duct portion extends from a first margin region of the main portion and returns to a second margin region of the main portion. The heat input surface region is between the first margin region and the second margin region of the main portion. The main portion and the duct portion form a closed loop structure. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4480285A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4480285A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4480285A13</originalsourceid><addsrcrecordid>eNrjZOANcwzwD1Jw9nD0dXIN4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BJiYWBkYWpo6GxkQoAQBugBw0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>VAPOR CHAMBER</title><source>esp@cenet</source><creator>WANG, Fumei ; CHENG, Chengyu ; HUNG, Yihsiang</creator><creatorcontrib>WANG, Fumei ; CHENG, Chengyu ; HUNG, Yihsiang</creatorcontrib><description>In some aspects, a vapor chamber includes a sealed enclosure. The sealed enclosure includes: a main portion defining a main chamber and a duct portion. The main portion has a heat input surface region for contacting a heat source. The duct portion extends from a first margin region of the main portion and returns to a second margin region of the main portion. The heat input surface region is between the first margin region and the second margin region of the main portion. The main portion and the duct portion form a closed loop structure.</description><language>eng ; fre ; ger</language><subject>BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT ; HEATING ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; WEAPONS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241225&DB=EPODOC&CC=EP&NR=4480285A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241225&DB=EPODOC&CC=EP&NR=4480285A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WANG, Fumei</creatorcontrib><creatorcontrib>CHENG, Chengyu</creatorcontrib><creatorcontrib>HUNG, Yihsiang</creatorcontrib><title>VAPOR CHAMBER</title><description>In some aspects, a vapor chamber includes a sealed enclosure. The sealed enclosure includes: a main portion defining a main chamber and a duct portion. The main portion has a heat input surface region for contacting a heat source. The duct portion extends from a first margin region of the main portion and returns to a second margin region of the main portion. The heat input surface region is between the first margin region and the second margin region of the main portion. The main portion and the duct portion form a closed loop structure.</description><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL ENGINEERING</subject><subject>PRINTED CIRCUITS</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOANcwzwD1Jw9nD0dXIN4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BJiYWBkYWpo6GxkQoAQBugBw0</recordid><startdate>20241225</startdate><enddate>20241225</enddate><creator>WANG, Fumei</creator><creator>CHENG, Chengyu</creator><creator>HUNG, Yihsiang</creator><scope>EVB</scope></search><sort><creationdate>20241225</creationdate><title>VAPOR CHAMBER</title><author>WANG, Fumei ; CHENG, Chengyu ; HUNG, Yihsiang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4480285A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>PRINTED CIRCUITS</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>WANG, Fumei</creatorcontrib><creatorcontrib>CHENG, Chengyu</creatorcontrib><creatorcontrib>HUNG, Yihsiang</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WANG, Fumei</au><au>CHENG, Chengyu</au><au>HUNG, Yihsiang</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>VAPOR CHAMBER</title><date>2024-12-25</date><risdate>2024</risdate><abstract>In some aspects, a vapor chamber includes a sealed enclosure. The sealed enclosure includes: a main portion defining a main chamber and a duct portion. The main portion has a heat input surface region for contacting a heat source. The duct portion extends from a first margin region of the main portion and returns to a second margin region of the main portion. The heat input surface region is between the first margin region and the second margin region of the main portion. The main portion and the duct portion form a closed loop structure.</abstract><oa>free_for_read</oa></addata></record> |
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language | eng ; fre ; ger |
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subjects | BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS WEAPONS |
title | VAPOR CHAMBER |
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