SEMICONDUCTOR PACKAGE
A semiconductor package according to an embodiment comprises an insulating layer; and an electrode portion disposed on the insulating layer, wherein the electrode portion includes a plurality of pads and a trace connecting the plurality of pads, and wherein the plurality of pads includes a first pad...
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| Hauptverfasser: | , |
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | A semiconductor package according to an embodiment comprises an insulating layer; and an electrode portion disposed on the insulating layer, wherein the electrode portion includes a plurality of pads and a trace connecting the plurality of pads, and wherein the plurality of pads includes a first pad including a curved portion in a circumference of an upper surface has a specific radius of curvature and a straight portion connected to the curved portion; and a second pad that does not include a straight portion in a circumference of an upper surface facing the curved portion of the first pad. |
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