PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

A printed wiring board includes: a dielectric layer having a main surface; and a conductive pattern. The conductive pattern includes a metal layer that is disposed on the main surface, an electroless plating layer that is disposed on the metal layer, and an electrolytic plating layer that is dispose...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MIYATA, Kazuhiro, KIYA, Satoshi, NITTA, Koji, SAKAI, Shoichiro
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:A printed wiring board includes: a dielectric layer having a main surface; and a conductive pattern. The conductive pattern includes a metal layer that is disposed on the main surface, an electroless plating layer that is disposed on the metal layer, and an electrolytic plating layer that is disposed on the electroless plating layer. An average thickness of the metal layer is 2.1 µm or more and 9.0 µm or less. Maximum height roughness of a surface of the metal layer opposed to the main surface is 5.0 µm or less.