PACKAGE SUBSTRATES WITH EMBEDDED DIE-SIDE, FACE-UP DEEP TRENCH CAPACITOR(S) (DTC(S)), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS

Integrated circuit (IC) packages employing a package substrate with embedded deep trench capacitor(s) (DTC(s)) face-up to a semiconductor die ("die") for connection, and related fabrication methods. A DTC is embedded in a cavity in the package substrate and coupled to a die. To minimize co...

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Bibliographische Detailangaben

Hauptverfasser:	KANG, Kuiwon, KIM, Michelle Yejin, CHOI, Seongryul
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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