SIC MOLDED ARTICLE AND METHOD FOR MANUFACTURING SIC MOLDED ARTICLE

An object of the present disclosure is to provide a SiC formed body having low resistance and a method for producing the SiC formed body. The present disclosure provides a SiC formed body wherein a volume resistivity thereof is 7.0×10-3 Ω·cm or less, and a nitrogen concentration thereof is in a rang...

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Bibliographische Detailangaben
Hauptverfasser: OISHI Shohei, YASHIKIDA Reiko, IMAGAWA Mayuri, KUROYANAGI Akihiro
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:An object of the present disclosure is to provide a SiC formed body having low resistance and a method for producing the SiC formed body. The present disclosure provides a SiC formed body wherein a volume resistivity thereof is 7.0×10-3 Ω·cm or less, and a nitrogen concentration thereof is in a range exceeding 1000 ppm and up to 4500 ppm.