HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

A device comprises a substrate, a first die electrically coupled to the substrate, a second die electrically coupled to the substrate, and a bridge in the substrate, the bridge including a layer comprising a polymer, a first metal pad over the layer, a second metal pad over the layer, and a conducti...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ROY, Mihir K, LOTZ, Stefanie M, JEN, Wei-Lun Kane
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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