HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

A device comprises a substrate, a first die electrically coupled to the substrate, a second die electrically coupled to the substrate, and a bridge in the substrate, the bridge including a layer comprising a polymer, a first metal pad over the layer, a second metal pad over the layer, and a conducti...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ROY, Mihir K, LOTZ, Stefanie M, JEN, Wei-Lun Kane
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A device comprises a substrate, a first die electrically coupled to the substrate, a second die electrically coupled to the substrate, and a bridge in the substrate, the bridge including a layer comprising a polymer, a first metal pad over the layer, a second metal pad over the layer, and a conductive path electrically coupling the first metal pad to the second metal pad, wherein the first die is electrically coupled with the first metal pad of the bridge, and the second die is electrically coupled with the second metal pad of the bridge.