SINGLE-PIECE HIGH DATA RATE BACKPLANE CONNECTOR

This invention describes an improved backplane connector operating at speeds over 25 Gbps including a single-piece configuration that eliminates the insertion point present in 2-gender connectors. As a result, the signal path matches more closely the same path geometry that is found on the daughterb...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: POPSOR, Eduard, MINDRECI, Gaby Cristian
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:This invention describes an improved backplane connector operating at speeds over 25 Gbps including a single-piece configuration that eliminates the insertion point present in 2-gender connectors. As a result, the signal path matches more closely the same path geometry that is found on the daughterboard and on the backplane permitting superior signal integrity and lower losses through the signal transmission line from source to destination. The single-piece backplane connector comprises a protective cover slidably attached over a staggered body assembly. The protective cover comprises a plurality of contact orifices to permit the path through of a corresponding plurality of pin contacts located in a front portion of the staggered body assembly, and at least two guide orifices to permit the path through of at least two corresponding guide pins located in the front portion of the staggered body assembly. The staggered body assembly comprises a plurality of alternating PCB layers and dielectric spacers, wherein the PCB layers include a plurality of traces, wherein each trace electrically connects each of the pin contacts on the front end with a corresponding pin contact on the bottom mating with the corresponding plurality of plated through holes in the daughterboard PCB. Finally, the protective cover further comprises a return spring mechanism to slide from an unpressed position to a pressed position, and the protective cover slides towards the staggered body assembly to permit the pin contacts to protrude through the orifices and to mate with the corresponding plurality of plated through holes in the backplane PCB.