ELECTRONICS MODULE COMPRISING A PULSATING HEAT PIPE WITH A CHANNEL STRUCTURE

ELECTRONICS MODULE COMPRISING A PULSATING HEAT PIPE WITH A CHANNEL STRUCTURE

The invention relates to an electronics module (2) comprising a pulsating heat pipe (4) with a channel structure (14), in which a heat transfer medium (16) is arranged, and at least one electronic component (6) that is thermally conductively connected to the heat transfer medium (16). According to t...

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Hauptverfasser: SCHWARZ, Florian, PFEFFERLEIN, Stefan, STEGMEIER, Stefan, DANOV, Vladimir
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SCHWARZ, Florian
PFEFFERLEIN, Stefan
STEGMEIER, Stefan
DANOV, Vladimir
description The invention relates to an electronics module (2) comprising a pulsating heat pipe (4) with a channel structure (14), in which a heat transfer medium (16) is arranged, and at least one electronic component (6) that is thermally conductively connected to the heat transfer medium (16). According to the invention, in order to allow for improved cooling in comparison to the prior art, the pulsating heat pipe (4) has at least one main body (12) in which the channel structure (14) is at least partially formed, wherein the main body (12) has at least one recess (26), wherein a respective rib (28, 30) is secured in the at least one recess (26), which protrudes, in particular orthogonally, over a surface (20) of the main body (12).
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4427266A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4427266A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4427266A13</originalsourceid><addsrcrecordid>eNqNikEKwjAQAHPxIOof9gMerKWew7qahTRZkg0eS5F4Ei3U_6OCD_A0AzNL48kTaoqBMUMfj8UTYOwlceZwBgtSfLb6dUdWQVgILqzuk9DZEMhD1lRQS6K1WdzG-1w3P64MnEjRbev0HOo8jdf6qK-BpG2bQ9N1drf_Y3kDbNItpA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONICS MODULE COMPRISING A PULSATING HEAT PIPE WITH A CHANNEL STRUCTURE</title><source>esp@cenet</source><creator>SCHWARZ, Florian ; PFEFFERLEIN, Stefan ; STEGMEIER, Stefan ; DANOV, Vladimir</creator><creatorcontrib>SCHWARZ, Florian ; PFEFFERLEIN, Stefan ; STEGMEIER, Stefan ; DANOV, Vladimir</creatorcontrib><description>The invention relates to an electronics module (2) comprising a pulsating heat pipe (4) with a channel structure (14), in which a heat transfer medium (16) is arranged, and at least one electronic component (6) that is thermally conductively connected to the heat transfer medium (16). According to the invention, in order to allow for improved cooling in comparison to the prior art, the pulsating heat pipe (4) has at least one main body (12) in which the channel structure (14) is at least partially formed, wherein the main body (12) has at least one recess (26), wherein a respective rib (28, 30) is secured in the at least one recess (26), which protrudes, in particular orthogonally, over a surface (20) of the main body (12).</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240911&amp;DB=EPODOC&amp;CC=EP&amp;NR=4427266A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240911&amp;DB=EPODOC&amp;CC=EP&amp;NR=4427266A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SCHWARZ, Florian</creatorcontrib><creatorcontrib>PFEFFERLEIN, Stefan</creatorcontrib><creatorcontrib>STEGMEIER, Stefan</creatorcontrib><creatorcontrib>DANOV, Vladimir</creatorcontrib><title>ELECTRONICS MODULE COMPRISING A PULSATING HEAT PIPE WITH A CHANNEL STRUCTURE</title><description>The invention relates to an electronics module (2) comprising a pulsating heat pipe (4) with a channel structure (14), in which a heat transfer medium (16) is arranged, and at least one electronic component (6) that is thermally conductively connected to the heat transfer medium (16). According to the invention, in order to allow for improved cooling in comparison to the prior art, the pulsating heat pipe (4) has at least one main body (12) in which the channel structure (14) is at least partially formed, wherein the main body (12) has at least one recess (26), wherein a respective rib (28, 30) is secured in the at least one recess (26), which protrudes, in particular orthogonally, over a surface (20) of the main body (12).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNikEKwjAQAHPxIOof9gMerKWew7qahTRZkg0eS5F4Ei3U_6OCD_A0AzNL48kTaoqBMUMfj8UTYOwlceZwBgtSfLb6dUdWQVgILqzuk9DZEMhD1lRQS6K1WdzG-1w3P64MnEjRbev0HOo8jdf6qK-BpG2bQ9N1drf_Y3kDbNItpA</recordid><startdate>20240911</startdate><enddate>20240911</enddate><creator>SCHWARZ, Florian</creator><creator>PFEFFERLEIN, Stefan</creator><creator>STEGMEIER, Stefan</creator><creator>DANOV, Vladimir</creator><scope>EVB</scope></search><sort><creationdate>20240911</creationdate><title>ELECTRONICS MODULE COMPRISING A PULSATING HEAT PIPE WITH A CHANNEL STRUCTURE</title><author>SCHWARZ, Florian ; PFEFFERLEIN, Stefan ; STEGMEIER, Stefan ; DANOV, Vladimir</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4427266A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SCHWARZ, Florian</creatorcontrib><creatorcontrib>PFEFFERLEIN, Stefan</creatorcontrib><creatorcontrib>STEGMEIER, Stefan</creatorcontrib><creatorcontrib>DANOV, Vladimir</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SCHWARZ, Florian</au><au>PFEFFERLEIN, Stefan</au><au>STEGMEIER, Stefan</au><au>DANOV, Vladimir</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONICS MODULE COMPRISING A PULSATING HEAT PIPE WITH A CHANNEL STRUCTURE</title><date>2024-09-11</date><risdate>2024</risdate><abstract>The invention relates to an electronics module (2) comprising a pulsating heat pipe (4) with a channel structure (14), in which a heat transfer medium (16) is arranged, and at least one electronic component (6) that is thermally conductively connected to the heat transfer medium (16). According to the invention, in order to allow for improved cooling in comparison to the prior art, the pulsating heat pipe (4) has at least one main body (12) in which the channel structure (14) is at least partially formed, wherein the main body (12) has at least one recess (26), wherein a respective rib (28, 30) is secured in the at least one recess (26), which protrudes, in particular orthogonally, over a surface (20) of the main body (12).</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title ELECTRONICS MODULE COMPRISING A PULSATING HEAT PIPE WITH A CHANNEL STRUCTURE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T11%3A05%3A50IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SCHWARZ,%20Florian&rft.date=2024-09-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4427266A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true