METHOD OF PRODUCING PRINT BOARD

METHOD OF PRODUCING PRINT BOARD

A sealing film (12) that is to be attached to a print board (10) when supplying filling material (16) into through holes (11) of the print board (10) with a printing method under a vacuum atmosphere, the sealing film (12) being to be attached to the print board (10) from an opposite side from a fill...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MORI, Yasumitsu, DOI, Akihiro
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator MORI, Yasumitsu
DOI, Akihiro
description A sealing film (12) that is to be attached to a print board (10) when supplying filling material (16) into through holes (11) of the print board (10) with a printing method under a vacuum atmosphere, the sealing film (12) being to be attached to the print board (10) from an opposite side from a filling material supplying side and separated from the print board (10) before starting a curing of the filling material (16), the sealing film (12) being made of synthetic resin and having a thickness being from 35 µm to 100 µm , the sealing film (12) comprising: a base film (12A) that has a smooth surface, the base film (12A) including micro holes (12C) having a diameter being from 10 µm to 100 µm and arranged at intervals of 2 mm to 4 mm; and an adhesive layer (12B) divided into adhesive layer (12B) portions that have a diameter being from 100 µm to 500 µm and are disposed on the base film at intervals of 10 µm to 400 µm.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4426076A2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4426076A2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4426076A23</originalsourceid><addsrcrecordid>eNrjZJD3dQ3x8HdR8HdTCAjydwl19vRzB7I8_UIUnPwdg1x4GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8a4CJiZGZgbmZo5ExEUoAiE8hIA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF PRODUCING PRINT BOARD</title><source>esp@cenet</source><creator>MORI, Yasumitsu ; DOI, Akihiro</creator><creatorcontrib>MORI, Yasumitsu ; DOI, Akihiro</creatorcontrib><description>A sealing film (12) that is to be attached to a print board (10) when supplying filling material (16) into through holes (11) of the print board (10) with a printing method under a vacuum atmosphere, the sealing film (12) being to be attached to the print board (10) from an opposite side from a filling material supplying side and separated from the print board (10) before starting a curing of the filling material (16), the sealing film (12) being made of synthetic resin and having a thickness being from 35 µm to 100 µm , the sealing film (12) comprising: a base film (12A) that has a smooth surface, the base film (12A) including micro holes (12C) having a diameter being from 10 µm to 100 µm and arranged at intervals of 2 mm to 4 mm; and an adhesive layer (12B) divided into adhesive layer (12B) portions that have a diameter being from 100 µm to 500 µm and are disposed on the base film at intervals of 10 µm to 400 µm.</description><language>eng ; fre ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240904&amp;DB=EPODOC&amp;CC=EP&amp;NR=4426076A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240904&amp;DB=EPODOC&amp;CC=EP&amp;NR=4426076A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MORI, Yasumitsu</creatorcontrib><creatorcontrib>DOI, Akihiro</creatorcontrib><title>METHOD OF PRODUCING PRINT BOARD</title><description>A sealing film (12) that is to be attached to a print board (10) when supplying filling material (16) into through holes (11) of the print board (10) with a printing method under a vacuum atmosphere, the sealing film (12) being to be attached to the print board (10) from an opposite side from a filling material supplying side and separated from the print board (10) before starting a curing of the filling material (16), the sealing film (12) being made of synthetic resin and having a thickness being from 35 µm to 100 µm , the sealing film (12) comprising: a base film (12A) that has a smooth surface, the base film (12A) including micro holes (12C) having a diameter being from 10 µm to 100 µm and arranged at intervals of 2 mm to 4 mm; and an adhesive layer (12B) divided into adhesive layer (12B) portions that have a diameter being from 100 µm to 500 µm and are disposed on the base film at intervals of 10 µm to 400 µm.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD3dQ3x8HdR8HdTCAjydwl19vRzB7I8_UIUnPwdg1x4GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8a4CJiZGZgbmZo5ExEUoAiE8hIA</recordid><startdate>20240904</startdate><enddate>20240904</enddate><creator>MORI, Yasumitsu</creator><creator>DOI, Akihiro</creator><scope>EVB</scope></search><sort><creationdate>20240904</creationdate><title>METHOD OF PRODUCING PRINT BOARD</title><author>MORI, Yasumitsu ; DOI, Akihiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4426076A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MORI, Yasumitsu</creatorcontrib><creatorcontrib>DOI, Akihiro</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MORI, Yasumitsu</au><au>DOI, Akihiro</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF PRODUCING PRINT BOARD</title><date>2024-09-04</date><risdate>2024</risdate><abstract>A sealing film (12) that is to be attached to a print board (10) when supplying filling material (16) into through holes (11) of the print board (10) with a printing method under a vacuum atmosphere, the sealing film (12) being to be attached to the print board (10) from an opposite side from a filling material supplying side and separated from the print board (10) before starting a curing of the filling material (16), the sealing film (12) being made of synthetic resin and having a thickness being from 35 µm to 100 µm , the sealing film (12) comprising: a base film (12A) that has a smooth surface, the base film (12A) including micro holes (12C) having a diameter being from 10 µm to 100 µm and arranged at intervals of 2 mm to 4 mm; and an adhesive layer (12B) divided into adhesive layer (12B) portions that have a diameter being from 100 µm to 500 µm and are disposed on the base film at intervals of 10 µm to 400 µm.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP4426076A2
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title METHOD OF PRODUCING PRINT BOARD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-16T00%3A29%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MORI,%20Yasumitsu&rft.date=2024-09-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4426076A2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true