SOLDER JOINT INSPECTION FEATURES

A printed circuit board has a solder joint inspection system including a substrate surface having at least one solder pad thereon, at least one conductor wire having an end attached to the at least one solder pad, and a first inspection feature. A first inspection feature is marked on the substrate...

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Bibliographische Detailangaben
Hauptverfasser:	BREWSTER, Jeffery Todd, ANDERSON IV, William Edward, WOOD, Tyler William, HAWLEY, Heather Cassidy, MIDKIFF, George Edward, CANTANDO, Elizabeth
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER DYNAMO-ELECTRIC MACHINES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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