LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING PROCESSED SEMICONDUCTOR SUBSTRATE

There is a laminate including:a semiconductor substrate;a support substrate that is light-transmissive; andan adhesive layer and a release layer provided between the semiconductor substrate and the support substrate,the laminate being used when the release layer absorbs light irradiated from a side...

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Bibliographische Detailangaben
Hauptverfasser:	KISHIOKA, Takahiro, OKUNO, Takahisa, SHINJO, Tetsuya
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	There is a laminate including:a semiconductor substrate;a support substrate that is light-transmissive; andan adhesive layer and a release layer provided between the semiconductor substrate and the support substrate,the laminate being used when the release layer absorbs light irradiated from a side of the support substrate and then the semiconductor substrate and the support substrate are separated from each other, whereinthe release layer is formed from a release agent composition,the release agent composition contains a light-absorbing compound having a molecular weight of 2,000 or less, andwhen the light-absorbing compound is measured for an absorption spectrum in a range of 250 to 800 nm, the absorption spectrum has a local maximum value, which is a maximum absorbance in a range of 250 to 800 nm, between 250 nm and 350 nm.