PROCESSING SYSTEM
A processing system includes: a first processing apparatus that performs an additive manufacturing in a first processing area by emitting a first energy beam; a second processing apparatus that performs a removal processing in a second processing area by emitting a second energy beam; first and seco...
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| creator | EGAMI, Shigeki |
| description | A processing system includes: a first processing apparatus that performs an additive manufacturing in a first processing area by emitting a first energy beam; a second processing apparatus that performs a removal processing in a second processing area by emitting a second energy beam; first and second placing apparatuses on which the additive manufacturing and the removal processing are performed; a positional change apparatus that relatively moves the first and second placing apparatuses between the first and second processing areas; and first and second light receiving apparatuses respectively disposed on the first and second placing apparatuses, wherein each of the first and second light receiving apparatuses may optically receive at least one of the first and second energy beams, and information related to a position of the first placing apparatus is acquired by an optical received result by the first light receiving apparatus, and information related to a position of the second placing apparatus is acquired by an optical received result by the second light receiving apparatus. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4414119A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4414119A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4414119A13</originalsourceid><addsrcrecordid>eNrjZBAMCPJ3dg0O9vRzVwiODA5x9eVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuASYmhiaGhpaOhsZEKAEA-8odkg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PROCESSING SYSTEM</title><source>esp@cenet</source><creator>EGAMI, Shigeki</creator><creatorcontrib>EGAMI, Shigeki</creatorcontrib><description>A processing system includes: a first processing apparatus that performs an additive manufacturing in a first processing area by emitting a first energy beam; a second processing apparatus that performs a removal processing in a second processing area by emitting a second energy beam; first and second placing apparatuses on which the additive manufacturing and the removal processing are performed; a positional change apparatus that relatively moves the first and second placing apparatuses between the first and second processing areas; and first and second light receiving apparatuses respectively disposed on the first and second placing apparatuses, wherein each of the first and second light receiving apparatuses may optically receive at least one of the first and second energy beams, and information related to a position of the first placing apparatus is acquired by an optical received result by the first light receiving apparatus, and information related to a position of the second placing apparatus is acquired by an optical received result by the second light receiving apparatus.</description><language>eng ; fre ; ger</language><subject>ADDITIVE MANUFACTURING TECHNOLOGY ; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING ; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240814&DB=EPODOC&CC=EP&NR=4414119A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240814&DB=EPODOC&CC=EP&NR=4414119A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>EGAMI, Shigeki</creatorcontrib><title>PROCESSING SYSTEM</title><description>A processing system includes: a first processing apparatus that performs an additive manufacturing in a first processing area by emitting a first energy beam; a second processing apparatus that performs a removal processing in a second processing area by emitting a second energy beam; first and second placing apparatuses on which the additive manufacturing and the removal processing are performed; a positional change apparatus that relatively moves the first and second placing apparatuses between the first and second processing areas; and first and second light receiving apparatuses respectively disposed on the first and second placing apparatuses, wherein each of the first and second light receiving apparatuses may optically receive at least one of the first and second energy beams, and information related to a position of the first placing apparatus is acquired by an optical received result by the first light receiving apparatus, and information related to a position of the second placing apparatus is acquired by an optical received result by the second light receiving apparatus.</description><subject>ADDITIVE MANUFACTURING TECHNOLOGY</subject><subject>ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING</subject><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAMCPJ3dg0O9vRzVwiODA5x9eVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuASYmhiaGhpaOhsZEKAEA-8odkg</recordid><startdate>20240814</startdate><enddate>20240814</enddate><creator>EGAMI, Shigeki</creator><scope>EVB</scope></search><sort><creationdate>20240814</creationdate><title>PROCESSING SYSTEM</title><author>EGAMI, Shigeki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4414119A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>ADDITIVE MANUFACTURING TECHNOLOGY</topic><topic>ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING</topic><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>EGAMI, Shigeki</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>EGAMI, Shigeki</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PROCESSING SYSTEM</title><date>2024-08-14</date><risdate>2024</risdate><abstract>A processing system includes: a first processing apparatus that performs an additive manufacturing in a first processing area by emitting a first energy beam; a second processing apparatus that performs a removal processing in a second processing area by emitting a second energy beam; first and second placing apparatuses on which the additive manufacturing and the removal processing are performed; a positional change apparatus that relatively moves the first and second placing apparatuses between the first and second processing areas; and first and second light receiving apparatuses respectively disposed on the first and second placing apparatuses, wherein each of the first and second light receiving apparatuses may optically receive at least one of the first and second energy beams, and information related to a position of the first placing apparatus is acquired by an optical received result by the first light receiving apparatus, and information related to a position of the second placing apparatus is acquired by an optical received result by the second light receiving apparatus.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP4414119A1 |
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| subjects | ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | PROCESSING SYSTEM |
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