PRESSURE-SENSITIVE ADHESIVE SHEET FOR TEMPORARILY FIXING ELECTRONIC COMPONENT AND METHOD FOR TREATING ELECTRONIC COMPONENT
Provided is a pressure-sensitive adhesive sheet to be subjected to temporary fixing of an electronic part to a support, the pressure-sensitive adhesive sheet being capable of exhibiting peelability from the support through irradiation with laser light, and reducing a residue on the support after its...
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| creator | UENO, Shusaku KATO, Kazumichi HIRAYAMA, Takamasa |
| description | Provided is a pressure-sensitive adhesive sheet to be subjected to temporary fixing of an electronic part to a support, the pressure-sensitive adhesive sheet being capable of exhibiting peelability from the support through irradiation with laser light, and reducing a residue on the support after its peeling. A pressure-sensitive adhesive sheet for temporarily fixing an electronic part of the present invention includes: a photothermal conversion layer; and a thermal decomposition layer directly arranged on the photothermal conversion layer. A 5% weight loss temperature of the thermal decomposition layer after UV irradiation is lower than a 5% weight loss temperature of the photothermal conversion layer after UV irradiation. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4410912A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4410912A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4410912A13</originalsourceid><addsrcrecordid>eNqNi7EKwjAURbs4iPoP7wcKVrs4huTWBNqkvDxFp1IkTqKFOvn1KroKTvfAOXeaPVpGjDtGHuGjE7cHKWMR3xAtIFQFJkHTBlbs6iNV7uD8llBDCwfvNOnwsh5eSHlDDcQG87kxlPyK59nk3F_GtPjuLKMKom2ehluXxqE_pWu6d2jLslhuipUq1n8kTwpBOsg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PRESSURE-SENSITIVE ADHESIVE SHEET FOR TEMPORARILY FIXING ELECTRONIC COMPONENT AND METHOD FOR TREATING ELECTRONIC COMPONENT</title><source>esp@cenet</source><creator>UENO, Shusaku ; KATO, Kazumichi ; HIRAYAMA, Takamasa</creator><creatorcontrib>UENO, Shusaku ; KATO, Kazumichi ; HIRAYAMA, Takamasa</creatorcontrib><description>Provided is a pressure-sensitive adhesive sheet to be subjected to temporary fixing of an electronic part to a support, the pressure-sensitive adhesive sheet being capable of exhibiting peelability from the support through irradiation with laser light, and reducing a residue on the support after its peeling. A pressure-sensitive adhesive sheet for temporarily fixing an electronic part of the present invention includes: a photothermal conversion layer; and a thermal decomposition layer directly arranged on the photothermal conversion layer. A 5% weight loss temperature of the thermal decomposition layer after UV irradiation is lower than a 5% weight loss temperature of the photothermal conversion layer after UV irradiation.</description><language>eng ; fre ; ger</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240807&DB=EPODOC&CC=EP&NR=4410912A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240807&DB=EPODOC&CC=EP&NR=4410912A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UENO, Shusaku</creatorcontrib><creatorcontrib>KATO, Kazumichi</creatorcontrib><creatorcontrib>HIRAYAMA, Takamasa</creatorcontrib><title>PRESSURE-SENSITIVE ADHESIVE SHEET FOR TEMPORARILY FIXING ELECTRONIC COMPONENT AND METHOD FOR TREATING ELECTRONIC COMPONENT</title><description>Provided is a pressure-sensitive adhesive sheet to be subjected to temporary fixing of an electronic part to a support, the pressure-sensitive adhesive sheet being capable of exhibiting peelability from the support through irradiation with laser light, and reducing a residue on the support after its peeling. A pressure-sensitive adhesive sheet for temporarily fixing an electronic part of the present invention includes: a photothermal conversion layer; and a thermal decomposition layer directly arranged on the photothermal conversion layer. A 5% weight loss temperature of the thermal decomposition layer after UV irradiation is lower than a 5% weight loss temperature of the photothermal conversion layer after UV irradiation.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi7EKwjAURbs4iPoP7wcKVrs4huTWBNqkvDxFp1IkTqKFOvn1KroKTvfAOXeaPVpGjDtGHuGjE7cHKWMR3xAtIFQFJkHTBlbs6iNV7uD8llBDCwfvNOnwsh5eSHlDDcQG87kxlPyK59nk3F_GtPjuLKMKom2ehluXxqE_pWu6d2jLslhuipUq1n8kTwpBOsg</recordid><startdate>20240807</startdate><enddate>20240807</enddate><creator>UENO, Shusaku</creator><creator>KATO, Kazumichi</creator><creator>HIRAYAMA, Takamasa</creator><scope>EVB</scope></search><sort><creationdate>20240807</creationdate><title>PRESSURE-SENSITIVE ADHESIVE SHEET FOR TEMPORARILY FIXING ELECTRONIC COMPONENT AND METHOD FOR TREATING ELECTRONIC COMPONENT</title><author>UENO, Shusaku ; KATO, Kazumichi ; HIRAYAMA, Takamasa</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4410912A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>UENO, Shusaku</creatorcontrib><creatorcontrib>KATO, Kazumichi</creatorcontrib><creatorcontrib>HIRAYAMA, Takamasa</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UENO, Shusaku</au><au>KATO, Kazumichi</au><au>HIRAYAMA, Takamasa</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRESSURE-SENSITIVE ADHESIVE SHEET FOR TEMPORARILY FIXING ELECTRONIC COMPONENT AND METHOD FOR TREATING ELECTRONIC COMPONENT</title><date>2024-08-07</date><risdate>2024</risdate><abstract>Provided is a pressure-sensitive adhesive sheet to be subjected to temporary fixing of an electronic part to a support, the pressure-sensitive adhesive sheet being capable of exhibiting peelability from the support through irradiation with laser light, and reducing a residue on the support after its peeling. A pressure-sensitive adhesive sheet for temporarily fixing an electronic part of the present invention includes: a photothermal conversion layer; and a thermal decomposition layer directly arranged on the photothermal conversion layer. A 5% weight loss temperature of the thermal decomposition layer after UV irradiation is lower than a 5% weight loss temperature of the photothermal conversion layer after UV irradiation.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | PRESSURE-SENSITIVE ADHESIVE SHEET FOR TEMPORARILY FIXING ELECTRONIC COMPONENT AND METHOD FOR TREATING ELECTRONIC COMPONENT |
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