ELIMINATING SUBSTRATE METAL CRACKS IN A BALL GRID ARRAY PACKAGE

An apparatus includes a substrate including a planar surface. A die is attached to the planar surface of the substrate with an interposed die attach material. A solder mask is interposed between the die attach material and the planar surface, wherein the solder mask includes a recessed portion exten...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Liu, Huanhuan, Khoo, Ly Hoon, Lim, Swee Yean
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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