ELIMINATING SUBSTRATE METAL CRACKS IN A BALL GRID ARRAY PACKAGE

ELIMINATING SUBSTRATE METAL CRACKS IN A BALL GRID ARRAY PACKAGE

An apparatus includes a substrate including a planar surface. A die is attached to the planar surface of the substrate with an interposed die attach material. A solder mask is interposed between the die attach material and the planar surface, wherein the solder mask includes a recessed portion exten...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Liu, Huanhuan, Khoo, Ly Hoon, Lim, Swee Yean
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An apparatus includes a substrate including a planar surface. A die is attached to the planar surface of the substrate with an interposed die attach material. A solder mask is interposed between the die attach material and the planar surface, wherein the solder mask includes a recessed portion extending beneath a periphery of the die, the recessed portion filled with a molding underfill.