HIGH FREQUENCY DEVICE PACKAGES

An integrated device package may include a glass interposer having one or more conductive vias extending through the glass interposer from a top side of the glass interposer to a bottom side of the glass interposer, the bottom side of the glass interposer comprising one or more contact pads. The dev...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Goida, Thomas M, Vidyarthy, Sharad, Kudtarkar, Santosh Anil, Raj, Arun
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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