HIGH FREQUENCY DEVICE PACKAGES

HIGH FREQUENCY DEVICE PACKAGES

An integrated device package may include a glass interposer having one or more conductive vias extending through the glass interposer from a top side of the glass interposer to a bottom side of the glass interposer, the bottom side of the glass interposer comprising one or more contact pads. The dev...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Goida, Thomas M, Vidyarthy, Sharad, Kudtarkar, Santosh Anil, Raj, Arun
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Goida, Thomas M
Vidyarthy, Sharad
Kudtarkar, Santosh Anil
Raj, Arun
description An integrated device package may include a glass interposer having one or more conductive vias extending through the glass interposer from a top side of the glass interposer to a bottom side of the glass interposer, the bottom side of the glass interposer comprising one or more contact pads. The device package may include an integrated device die mounted and electrically connected to the top side of the glass interposer. The device package may also include an encapsulating material disposed over at least a side surface of the glass interposer, a portion of the top surface of the glass interposer, and a side surface of the integrated device die.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4398293A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4398293A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4398293A13</originalsourceid><addsrcrecordid>eNrjZJDz8HT3UHALcg0MdfVzjlRwcQ3zdHZVCHB09nZ0dw3mYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgEmxpYWRpbGjobGRCgBAGM6INo</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HIGH FREQUENCY DEVICE PACKAGES</title><source>esp@cenet</source><creator>Goida, Thomas M ; Vidyarthy, Sharad ; Kudtarkar, Santosh Anil ; Raj, Arun</creator><creatorcontrib>Goida, Thomas M ; Vidyarthy, Sharad ; Kudtarkar, Santosh Anil ; Raj, Arun</creatorcontrib><description>An integrated device package may include a glass interposer having one or more conductive vias extending through the glass interposer from a top side of the glass interposer to a bottom side of the glass interposer, the bottom side of the glass interposer comprising one or more contact pads. The device package may include an integrated device die mounted and electrically connected to the top side of the glass interposer. The device package may also include an encapsulating material disposed over at least a side surface of the glass interposer, a portion of the top surface of the glass interposer, and a side surface of the integrated device die.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240710&amp;DB=EPODOC&amp;CC=EP&amp;NR=4398293A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240710&amp;DB=EPODOC&amp;CC=EP&amp;NR=4398293A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Goida, Thomas M</creatorcontrib><creatorcontrib>Vidyarthy, Sharad</creatorcontrib><creatorcontrib>Kudtarkar, Santosh Anil</creatorcontrib><creatorcontrib>Raj, Arun</creatorcontrib><title>HIGH FREQUENCY DEVICE PACKAGES</title><description>An integrated device package may include a glass interposer having one or more conductive vias extending through the glass interposer from a top side of the glass interposer to a bottom side of the glass interposer, the bottom side of the glass interposer comprising one or more contact pads. The device package may include an integrated device die mounted and electrically connected to the top side of the glass interposer. The device package may also include an encapsulating material disposed over at least a side surface of the glass interposer, a portion of the top surface of the glass interposer, and a side surface of the integrated device die.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDz8HT3UHALcg0MdfVzjlRwcQ3zdHZVCHB09nZ0dw3mYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgEmxpYWRpbGjobGRCgBAGM6INo</recordid><startdate>20240710</startdate><enddate>20240710</enddate><creator>Goida, Thomas M</creator><creator>Vidyarthy, Sharad</creator><creator>Kudtarkar, Santosh Anil</creator><creator>Raj, Arun</creator><scope>EVB</scope></search><sort><creationdate>20240710</creationdate><title>HIGH FREQUENCY DEVICE PACKAGES</title><author>Goida, Thomas M ; Vidyarthy, Sharad ; Kudtarkar, Santosh Anil ; Raj, Arun</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4398293A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Goida, Thomas M</creatorcontrib><creatorcontrib>Vidyarthy, Sharad</creatorcontrib><creatorcontrib>Kudtarkar, Santosh Anil</creatorcontrib><creatorcontrib>Raj, Arun</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Goida, Thomas M</au><au>Vidyarthy, Sharad</au><au>Kudtarkar, Santosh Anil</au><au>Raj, Arun</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HIGH FREQUENCY DEVICE PACKAGES</title><date>2024-07-10</date><risdate>2024</risdate><abstract>An integrated device package may include a glass interposer having one or more conductive vias extending through the glass interposer from a top side of the glass interposer to a bottom side of the glass interposer, the bottom side of the glass interposer comprising one or more contact pads. The device package may include an integrated device die mounted and electrically connected to the top side of the glass interposer. The device package may also include an encapsulating material disposed over at least a side surface of the glass interposer, a portion of the top surface of the glass interposer, and a side surface of the integrated device die.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP4398293A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title HIGH FREQUENCY DEVICE PACKAGES
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T23%3A59%3A27IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Goida,%20Thomas%20M&rft.date=2024-07-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4398293A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true