WAFER-SCALE DIRECT BONDED ARRAY CORE BLOCK FOR AN ACTIVE ELECTRONICALLY STEERABLE ARRAY (AESA)

An Array Core Block for an AESA includes a stack of 2*M alternating N-channel RFIC and MMIC Power Amplifier wafers bonded together by a wafer-scale direct bond hybrid (DBH) interconnect process. This process forms both metal-to-metal and dielectric hydrogen bonds between bonding surfaces to seal the...

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Bibliographische Detailangaben

Hauptverfasser:	HERRICK, Katherine J, LAROCHE, Jeffrey R, MICOVIC, Miroslav, CARBONNEAU, Christopher, BAKER, Karen Kaneko, CLEMENT, Teresa J
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES TRANSMISSION
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