BRIDGING AGENT, COMPOSITION, MASTERBATCH, PACKAGING FILM AND ELECTRONIC COMPONENT
The disclosure provides a bridging agent, a composition, a masterbatch, an encapsulating glue film and an electronic component. The bridging agent has a cyclic structure with the following general structural formula: R1xR2y[CH3SiO]n, wherein n is an even number and 4≤n≤10; R1 and R2 are both connect...
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| creator | MEI, Yunxiao TANG, Guodong HOU, Hongbing WEI, Mengjuan ZHOU, Guangda LI, Bogeng |
| description | The disclosure provides a bridging agent, a composition, a masterbatch, an encapsulating glue film and an electronic component. The bridging agent has a cyclic structure with the following general structural formula: R1xR2y[CH3SiO]n, wherein n is an even number and 4≤n≤10; R1 and R2 are both connected to Si atoms, and the R1 is a group having a terminal double bond; the R2 is a linear alkyl group or a branched alkyl group having 4 to 14 carbon atoms; x is an even number greater than 1 and less than the n, and x+y is equal to the n; R1s are in pairwise alignment, R2s are in pairwise alignment, the R1s in pairwise alignment are the same, the R2s in pairwise alignment are the same, the R1s that are not in alignment are either the same or different, and the R2s that are not in alignment are either the same or different. The bridging agent of the present disclosure reduces the probability of migration in a polyolefin resin, thereby the creep resistance of the polyolefin resin is improved, and the service life of the electronic component is prolonged. |
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The bridging agent has a cyclic structure with the following general structural formula: R1xR2y[CH3SiO]n, wherein n is an even number and 4≤n≤10; R1 and R2 are both connected to Si atoms, and the R1 is a group having a terminal double bond; the R2 is a linear alkyl group or a branched alkyl group having 4 to 14 carbon atoms; x is an even number greater than 1 and less than the n, and x+y is equal to the n; R1s are in pairwise alignment, R2s are in pairwise alignment, the R1s in pairwise alignment are the same, the R2s in pairwise alignment are the same, the R1s that are not in alignment are either the same or different, and the R2s that are not in alignment are either the same or different. The bridging agent of the present disclosure reduces the probability of migration in a polyolefin resin, thereby the creep resistance of the polyolefin resin is improved, and the service life of the electronic component is prolonged.</description><language>eng ; fre ; ger</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241225&DB=EPODOC&CC=EP&NR=4394013A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241225&DB=EPODOC&CC=EP&NR=4394013A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MEI, Yunxiao</creatorcontrib><creatorcontrib>TANG, Guodong</creatorcontrib><creatorcontrib>HOU, Hongbing</creatorcontrib><creatorcontrib>WEI, Mengjuan</creatorcontrib><creatorcontrib>ZHOU, Guangda</creatorcontrib><creatorcontrib>LI, Bogeng</creatorcontrib><title>BRIDGING AGENT, COMPOSITION, MASTERBATCH, PACKAGING FILM AND ELECTRONIC COMPONENT</title><description>The disclosure provides a bridging agent, a composition, a masterbatch, an encapsulating glue film and an electronic component. The bridging agent has a cyclic structure with the following general structural formula: R1xR2y[CH3SiO]n, wherein n is an even number and 4≤n≤10; R1 and R2 are both connected to Si atoms, and the R1 is a group having a terminal double bond; the R2 is a linear alkyl group or a branched alkyl group having 4 to 14 carbon atoms; x is an even number greater than 1 and less than the n, and x+y is equal to the n; R1s are in pairwise alignment, R2s are in pairwise alignment, the R1s in pairwise alignment are the same, the R2s in pairwise alignment are the same, the R1s that are not in alignment are either the same or different, and the R2s that are not in alignment are either the same or different. The bridging agent of the present disclosure reduces the probability of migration in a polyolefin resin, thereby the creep resistance of the polyolefin resin is improved, and the service life of the electronic component is prolonged.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAh0CvJ0cff0c1dwdHf1C9FRcPb3DfAP9gzx9PfTUfB1DA5xDXJyDHH20FEIcHT2dgQrdfP08VVw9HNRcPVxdQ4J8vfzdIbo8wMawcPAmpaYU5zKC6W5GRTcXIEG6KYW5MenFhckJqfmpZbEuwaYGFuaGBgaO5oYE6EEACIHLqw</recordid><startdate>20241225</startdate><enddate>20241225</enddate><creator>MEI, Yunxiao</creator><creator>TANG, Guodong</creator><creator>HOU, Hongbing</creator><creator>WEI, Mengjuan</creator><creator>ZHOU, Guangda</creator><creator>LI, Bogeng</creator><scope>EVB</scope></search><sort><creationdate>20241225</creationdate><title>BRIDGING AGENT, COMPOSITION, MASTERBATCH, PACKAGING FILM AND ELECTRONIC COMPONENT</title><author>MEI, Yunxiao ; TANG, Guodong ; HOU, Hongbing ; WEI, Mengjuan ; ZHOU, Guangda ; LI, Bogeng</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4394013A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>MEI, Yunxiao</creatorcontrib><creatorcontrib>TANG, Guodong</creatorcontrib><creatorcontrib>HOU, Hongbing</creatorcontrib><creatorcontrib>WEI, Mengjuan</creatorcontrib><creatorcontrib>ZHOU, Guangda</creatorcontrib><creatorcontrib>LI, Bogeng</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MEI, Yunxiao</au><au>TANG, Guodong</au><au>HOU, Hongbing</au><au>WEI, Mengjuan</au><au>ZHOU, Guangda</au><au>LI, Bogeng</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>BRIDGING AGENT, COMPOSITION, MASTERBATCH, PACKAGING FILM AND ELECTRONIC COMPONENT</title><date>2024-12-25</date><risdate>2024</risdate><abstract>The disclosure provides a bridging agent, a composition, a masterbatch, an encapsulating glue film and an electronic component. The bridging agent has a cyclic structure with the following general structural formula: R1xR2y[CH3SiO]n, wherein n is an even number and 4≤n≤10; R1 and R2 are both connected to Si atoms, and the R1 is a group having a terminal double bond; the R2 is a linear alkyl group or a branched alkyl group having 4 to 14 carbon atoms; x is an even number greater than 1 and less than the n, and x+y is equal to the n; R1s are in pairwise alignment, R2s are in pairwise alignment, the R1s in pairwise alignment are the same, the R2s in pairwise alignment are the same, the R1s that are not in alignment are either the same or different, and the R2s that are not in alignment are either the same or different. The bridging agent of the present disclosure reduces the probability of migration in a polyolefin resin, thereby the creep resistance of the polyolefin resin is improved, and the service life of the electronic component is prolonged.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | BRIDGING AGENT, COMPOSITION, MASTERBATCH, PACKAGING FILM AND ELECTRONIC COMPONENT |
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