WIRING SUBSTRATE

In a wiring board, a first substrate (10), a surface electrical conductor layer (12), and a second substrate (20) are laminated in this order. The second substrate (20) contains an organic material as an insulating base material. The surface electrical conductor layer (12) is located on a surface of...

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Hauptverfasser:	OKAMOTO, Kazuhiro, MATSUMOTO, Yuhei, YAMAMOTO, Sentarou
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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creator	OKAMOTO, Kazuhiro MATSUMOTO, Yuhei YAMAMOTO, Sentarou
description	In a wiring board, a first substrate (10), a surface electrical conductor layer (12), and a second substrate (20) are laminated in this order. The second substrate (20) contains an organic material as an insulating base material. The surface electrical conductor layer (12) is located on a surface of the first substrate (20), and the second substrate (20) includes a plurality of interlayer connection conductors (22). The insulating base material of the second substrate (20) includes a first region (211) and a second region (212). The first region (211) is located on the surface electrical conductor layer. The second region (212) is located on the surface of the first substrate. The first region (211) has a lower ratio of voids and pores than the second region (212).
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subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
title	WIRING SUBSTRATE
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