SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MANAGEMENT

According to one embodiment, a thermal management system for electronic devices (610, 620), including a heat frame (625), a conformal slot portion, chassis frame, and heat fins (670) wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Rush, Brian Magann, Wetzel, Todd Garrett, Lassini, Stefano Angelo Mario, Gerstler, William Dwight
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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