INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCESSES IMPLEMENTING THE SAME

INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCESSES IMPLEMENTING THE SAME

A transistor package that includes a metal submount; a transistor die mounted on said metal submount; a surface mount IPD component that includes a dielectric substrate; and the dielectric substrate mounted on said metal submount. Additionally, the dielectric substrate includes one of the following:...

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Hauptverfasser: MARBELL, Marvin, JANG, Haedong, KOMPOSCH, Alexander, CHEANG, Samantha, KAM, Kok Meng, WOO, Eng Wah
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator MARBELL, Marvin
JANG, Haedong
KOMPOSCH, Alexander
CHEANG, Samantha
KAM, Kok Meng
WOO, Eng Wah
description A transistor package that includes a metal submount; a transistor die mounted on said metal submount; a surface mount IPD component that includes a dielectric substrate; and the dielectric substrate mounted on said metal submount. Additionally, the dielectric substrate includes one of the following: an irregular shape, a non-square shape, and a nonrectangular shape.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4352787A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4352787A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4352787A13</originalsourceid><addsrcrecordid>eNqNyrEKwjAURuEuDqK-wx11cNAq7XpJftOgSUNv6CSUInESLdT3xyI-gNPhwDfPrtZHmIYjNAUWsS1Io7UKtLZBb0jVLtQePgqx18STUmc2-F5oagURCFkXLnATs95QrEDCDstsdu8fY1r9usjohKiqbRpeXRqH_pae6d0hHPLjvigL3uV_kA8N0DFz</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCESSES IMPLEMENTING THE SAME</title><source>esp@cenet</source><creator>MARBELL, Marvin ; JANG, Haedong ; KOMPOSCH, Alexander ; CHEANG, Samantha ; KAM, Kok Meng ; WOO, Eng Wah</creator><creatorcontrib>MARBELL, Marvin ; JANG, Haedong ; KOMPOSCH, Alexander ; CHEANG, Samantha ; KAM, Kok Meng ; WOO, Eng Wah</creatorcontrib><description>A transistor package that includes a metal submount; a transistor die mounted on said metal submount; a surface mount IPD component that includes a dielectric substrate; and the dielectric substrate mounted on said metal submount. Additionally, the dielectric substrate includes one of the following: an irregular shape, a non-square shape, and a nonrectangular shape.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240417&amp;DB=EPODOC&amp;CC=EP&amp;NR=4352787A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240417&amp;DB=EPODOC&amp;CC=EP&amp;NR=4352787A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MARBELL, Marvin</creatorcontrib><creatorcontrib>JANG, Haedong</creatorcontrib><creatorcontrib>KOMPOSCH, Alexander</creatorcontrib><creatorcontrib>CHEANG, Samantha</creatorcontrib><creatorcontrib>KAM, Kok Meng</creatorcontrib><creatorcontrib>WOO, Eng Wah</creatorcontrib><title>INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCESSES IMPLEMENTING THE SAME</title><description>A transistor package that includes a metal submount; a transistor die mounted on said metal submount; a surface mount IPD component that includes a dielectric substrate; and the dielectric substrate mounted on said metal submount. Additionally, the dielectric substrate includes one of the following: an irregular shape, a non-square shape, and a nonrectangular shape.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAURuEuDqK-wx11cNAq7XpJftOgSUNv6CSUInESLdT3xyI-gNPhwDfPrtZHmIYjNAUWsS1Io7UKtLZBb0jVLtQePgqx18STUmc2-F5oagURCFkXLnATs95QrEDCDstsdu8fY1r9usjohKiqbRpeXRqH_pae6d0hHPLjvigL3uV_kA8N0DFz</recordid><startdate>20240417</startdate><enddate>20240417</enddate><creator>MARBELL, Marvin</creator><creator>JANG, Haedong</creator><creator>KOMPOSCH, Alexander</creator><creator>CHEANG, Samantha</creator><creator>KAM, Kok Meng</creator><creator>WOO, Eng Wah</creator><scope>EVB</scope></search><sort><creationdate>20240417</creationdate><title>INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCESSES IMPLEMENTING THE SAME</title><author>MARBELL, Marvin ; JANG, Haedong ; KOMPOSCH, Alexander ; CHEANG, Samantha ; KAM, Kok Meng ; WOO, Eng Wah</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4352787A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MARBELL, Marvin</creatorcontrib><creatorcontrib>JANG, Haedong</creatorcontrib><creatorcontrib>KOMPOSCH, Alexander</creatorcontrib><creatorcontrib>CHEANG, Samantha</creatorcontrib><creatorcontrib>KAM, Kok Meng</creatorcontrib><creatorcontrib>WOO, Eng Wah</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MARBELL, Marvin</au><au>JANG, Haedong</au><au>KOMPOSCH, Alexander</au><au>CHEANG, Samantha</au><au>KAM, Kok Meng</au><au>WOO, Eng Wah</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCESSES IMPLEMENTING THE SAME</title><date>2024-04-17</date><risdate>2024</risdate><abstract>A transistor package that includes a metal submount; a transistor die mounted on said metal submount; a surface mount IPD component that includes a dielectric substrate; and the dielectric substrate mounted on said metal submount. Additionally, the dielectric substrate includes one of the following: an irregular shape, a non-square shape, and a nonrectangular shape.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCESSES IMPLEMENTING THE SAME
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-21T10%3A57%3A29IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MARBELL,%20Marvin&rft.date=2024-04-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4352787A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true