A VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD
An apparatus includes a printed circuit board (PCB), a solder pad, a signal via, a plurality of metalized vias, and a waveguide. The PCB has a first surface opposite a second surface and includes a first metal layer, a second metal layer having a waveguide opening, and a PCB channel region from the...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Zanati, Abdellatif Buijsman, Adrianus Steigemann, Mark |
| description | An apparatus includes a printed circuit board (PCB), a solder pad, a signal via, a plurality of metalized vias, and a waveguide. The PCB has a first surface opposite a second surface and includes a first metal layer, a second metal layer having a waveguide opening, and a PCB channel region from the waveguide opening in the second metal layer to the second surface. The solder pad is positioned on the first surface of the PCB over the channel region, and the signal via is coupled to the solder pad and a via pad in the second metal layer within the waveguide opening. The plurality of metalized vias extend from the first surface to the second surface of the PCB and form a boundary around the channel region. The waveguide is affixed to the waveguide opening in the second metal layer. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4350878A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4350878A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4350878A13</originalsourceid><addsrcrecordid>eNrjZNB3VAhzDQrxdHb0UfBxDPVz9nANUnDzD1JwVAgI8vQLcXVRcPYMcg71DFFw8ncMcuFhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuASbGpgYW5haOhsZEKAEAlRclSg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>A VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD</title><source>esp@cenet</source><creator>Zanati, Abdellatif ; Buijsman, Adrianus ; Steigemann, Mark</creator><creatorcontrib>Zanati, Abdellatif ; Buijsman, Adrianus ; Steigemann, Mark</creatorcontrib><description>An apparatus includes a printed circuit board (PCB), a solder pad, a signal via, a plurality of metalized vias, and a waveguide. The PCB has a first surface opposite a second surface and includes a first metal layer, a second metal layer having a waveguide opening, and a PCB channel region from the waveguide opening in the second metal layer to the second surface. The solder pad is positioned on the first surface of the PCB over the channel region, and the signal via is coupled to the solder pad and a via pad in the second metal layer within the waveguide opening. The plurality of metalized vias extend from the first surface to the second surface of the PCB and form a boundary around the channel region. The waveguide is affixed to the waveguide opening in the second metal layer.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE ; SEMICONDUCTOR DEVICES ; WAVEGUIDES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240410&DB=EPODOC&CC=EP&NR=4350878A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240410&DB=EPODOC&CC=EP&NR=4350878A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Zanati, Abdellatif</creatorcontrib><creatorcontrib>Buijsman, Adrianus</creatorcontrib><creatorcontrib>Steigemann, Mark</creatorcontrib><title>A VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD</title><description>An apparatus includes a printed circuit board (PCB), a solder pad, a signal via, a plurality of metalized vias, and a waveguide. The PCB has a first surface opposite a second surface and includes a first metal layer, a second metal layer having a waveguide opening, and a PCB channel region from the waveguide opening in the second metal layer to the second surface. The solder pad is positioned on the first surface of the PCB over the channel region, and the signal via is coupled to the solder pad and a via pad in the second metal layer within the waveguide opening. The plurality of metalized vias extend from the first surface to the second surface of the PCB and form a boundary around the channel region. The waveguide is affixed to the waveguide opening in the second metal layer.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WAVEGUIDES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB3VAhzDQrxdHb0UfBxDPVz9nANUnDzD1JwVAgI8vQLcXVRcPYMcg71DFFw8ncMcuFhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuASbGpgYW5haOhsZEKAEAlRclSg</recordid><startdate>20240410</startdate><enddate>20240410</enddate><creator>Zanati, Abdellatif</creator><creator>Buijsman, Adrianus</creator><creator>Steigemann, Mark</creator><scope>EVB</scope></search><sort><creationdate>20240410</creationdate><title>A VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD</title><author>Zanati, Abdellatif ; Buijsman, Adrianus ; Steigemann, Mark</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4350878A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WAVEGUIDES</topic><toplevel>online_resources</toplevel><creatorcontrib>Zanati, Abdellatif</creatorcontrib><creatorcontrib>Buijsman, Adrianus</creatorcontrib><creatorcontrib>Steigemann, Mark</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Zanati, Abdellatif</au><au>Buijsman, Adrianus</au><au>Steigemann, Mark</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>A VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD</title><date>2024-04-10</date><risdate>2024</risdate><abstract>An apparatus includes a printed circuit board (PCB), a solder pad, a signal via, a plurality of metalized vias, and a waveguide. The PCB has a first surface opposite a second surface and includes a first metal layer, a second metal layer having a waveguide opening, and a PCB channel region from the waveguide opening in the second metal layer to the second surface. The solder pad is positioned on the first surface of the PCB over the channel region, and the signal via is coupled to the solder pad and a via pad in the second metal layer within the waveguide opening. The plurality of metalized vias extend from the first surface to the second surface of the PCB and form a boundary around the channel region. The waveguide is affixed to the waveguide opening in the second metal layer.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP4350878A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE SEMICONDUCTOR DEVICES WAVEGUIDES |
| title | A VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T05%3A51%3A09IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Zanati,%20Abdellatif&rft.date=2024-04-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4350878A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |