HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND METHOD FOR ASSEMBLING CIRCUIT MODULE

This application relates to the field of communication technologies, and discloses a heat dissipation apparatus, a circuit module, an electronic device, and a circuit module assembly method. In the heat dissipation apparatus, a support is configured to be mounted to a circuit board, and an assembly...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MA, Weice, YING, Xiaoyuan, LIN, Benwei, CHEN, Wei
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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