ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES

Embodiments disclosed herein include electronic package and methods of forming such packages. In an embodiment, an electronic package comprises a mold layer and a first die embedded in the mold layer. In an embodiment, the first die comprises first pads at a first pitch and second pads at a second p...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SEIDEMANN, Georg, WOLTER, Andreas, WAGNER, Thomas, WAIDHAS, Bernd
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	SEIDEMANN, Georg WOLTER, Andreas WAGNER, Thomas WAIDHAS, Bernd
description	Embodiments disclosed herein include electronic package and methods of forming such packages. In an embodiment, an electronic package comprises a mold layer and a first die embedded in the mold layer. In an embodiment, the first die comprises first pads at a first pitch and second pads at a second pitch. In an embodiment, the electronic package further comprises a second die embedded in the mold layer, where the second die comprises third pads at the first pitch and fourth pads at the second pitch. In an embodiment, a bridge die is embedded in the mold layer, and the bridge die electrically couples the second pads to the fourth pads.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4325565A3</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4325565A3</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4325565A33</originalsourceid><addsrcrecordid>eNrjZLBzDA529XXyiVTwd1MwinBR8PV3CfVxVQgN9vRzV_DwdPdQcHH1C_YMiVTw9AtxDXL29_NzdQ5RcArydHF3DeZhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuASbGRqamZqaOxsZEKAEA98IpqA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES</title><source>esp@cenet</source><creator>SEIDEMANN, Georg ; WOLTER, Andreas ; WAGNER, Thomas ; WAIDHAS, Bernd</creator><creatorcontrib>SEIDEMANN, Georg ; WOLTER, Andreas ; WAGNER, Thomas ; WAIDHAS, Bernd</creatorcontrib><description>Embodiments disclosed herein include electronic package and methods of forming such packages. In an embodiment, an electronic package comprises a mold layer and a first die embedded in the mold layer. In an embodiment, the first die comprises first pads at a first pitch and second pads at a second pitch. In an embodiment, the electronic package further comprises a second die embedded in the mold layer, where the second die comprises third pads at the first pitch and fourth pads at the second pitch. In an embodiment, a bridge die is embedded in the mold layer, and the bridge die electrically couples the second pads to the fourth pads.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240703&DB=EPODOC&CC=EP&NR=4325565A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240703&DB=EPODOC&CC=EP&NR=4325565A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SEIDEMANN, Georg</creatorcontrib><creatorcontrib>WOLTER, Andreas</creatorcontrib><creatorcontrib>WAGNER, Thomas</creatorcontrib><creatorcontrib>WAIDHAS, Bernd</creatorcontrib><title>ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES</title><description>Embodiments disclosed herein include electronic package and methods of forming such packages. In an embodiment, an electronic package comprises a mold layer and a first die embedded in the mold layer. In an embodiment, the first die comprises first pads at a first pitch and second pads at a second pitch. In an embodiment, the electronic package further comprises a second die embedded in the mold layer, where the second die comprises third pads at the first pitch and fourth pads at the second pitch. In an embodiment, a bridge die is embedded in the mold layer, and the bridge die electrically couples the second pads to the fourth pads.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBzDA529XXyiVTwd1MwinBR8PV3CfVxVQgN9vRzV_DwdPdQcHH1C_YMiVTw9AtxDXL29_NzdQ5RcArydHF3DeZhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuASbGRqamZqaOxsZEKAEA98IpqA</recordid><startdate>20240703</startdate><enddate>20240703</enddate><creator>SEIDEMANN, Georg</creator><creator>WOLTER, Andreas</creator><creator>WAGNER, Thomas</creator><creator>WAIDHAS, Bernd</creator><scope>EVB</scope></search><sort><creationdate>20240703</creationdate><title>ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES</title><author>SEIDEMANN, Georg ; WOLTER, Andreas ; WAGNER, Thomas ; WAIDHAS, Bernd</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4325565A33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SEIDEMANN, Georg</creatorcontrib><creatorcontrib>WOLTER, Andreas</creatorcontrib><creatorcontrib>WAGNER, Thomas</creatorcontrib><creatorcontrib>WAIDHAS, Bernd</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SEIDEMANN, Georg</au><au>WOLTER, Andreas</au><au>WAGNER, Thomas</au><au>WAIDHAS, Bernd</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES</title><date>2024-07-03</date><risdate>2024</risdate><abstract>Embodiments disclosed herein include electronic package and methods of forming such packages. In an embodiment, an electronic package comprises a mold layer and a first die embedded in the mold layer. In an embodiment, the first die comprises first pads at a first pitch and second pads at a second pitch. In an embodiment, the electronic package further comprises a second die embedded in the mold layer, where the second die comprises third pads at the first pitch and fourth pads at the second pitch. In an embodiment, a bridge die is embedded in the mold layer, and the bridge die electrically couples the second pads to the fourth pads.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng ; fre ; ger
recordid	cdi_epo_espacenet_EP4325565A3
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-12T00%3A17%3A02IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SEIDEMANN,%20Georg&rft.date=2024-07-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4325565A3%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true