DRONE-HOSTED CONSTRUCTION DEFECT MARKING

A system includes processing circuitry and a drone that includes a marking mount that receives a marking device, a motion guide that provides a sliding framework for a reciprocating motion of the marking mount, and a shock absorption sub-assembly positioned between the marking mount and the motion g...

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Bibliographische Detailangaben
Hauptverfasser:	KNUDSON, Orlin B, RACE, Caitlin M, TATE, Francis J, BOWDEN, Patrick S, ANDERSON, Nathaniel D, KENDRICK, Paul A, WIDENBRANT, Martin J.O
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AEROPLANES AIRCRAFT ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS ARRANGEMENTS OR MOUNTING OF POWER PLANTS OR PROPULSIONTRANSMISSIONS IN AIRCRAFT AVIATION CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, ORTHE LIKE COSMONAUTICS EQUIPMENT FOR FITTING IN OR TO AIRCRAFT FIXED CONSTRUCTIONS FLYING SUITS HELICOPTERS MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR MEASURING MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PARACHUTES PERFORMING OPERATIONS PHYSICS TARIFF METERING APPARATUS TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	A system includes processing circuitry and a drone that includes a marking mount that receives a marking device, a motion guide that provides a sliding framework for a reciprocating motion of the marking mount, and a shock absorption sub-assembly positioned between the marking mount and the motion guide. Control logic of the drone is configured to navigate, based on navigation instructions received from the processing circuitry, the drone to an area associated with a misapplication of a tape as applied to a substrate or a substrate defect, such that a distal tip of the marking device makes contact with the area associated with the tape misapplication or the substrate defect, while activating the shock absorption sub-assembly to at least partially absorb a shock caused by the contact between the distal tip of the marking device and the area associated with the tape misapplication or the substrate defect.