POWER MODULE, AND METHOD FOR MANUFACTURING POWER MODULE

A power module includes: a circuit board on which a power semiconductor element is mounted; a base plate to which the circuit board is fixed; a terminal block including a base end surface which is fixed to an outer surface of the circuit board opposite to the base plate, a tip surface to which an ex...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: EZUMI, Masahiko
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!