POWER MODULE, AND METHOD FOR MANUFACTURING POWER MODULE

POWER MODULE, AND METHOD FOR MANUFACTURING POWER MODULE

A power module includes: a circuit board on which a power semiconductor element is mounted; a base plate to which the circuit board is fixed; a terminal block including a base end surface which is fixed to an outer surface of the circuit board opposite to the base plate, a tip surface to which an ex...

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1. Verfasser: EZUMI, Masahiko
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator EZUMI, Masahiko
description A power module includes: a circuit board on which a power semiconductor element is mounted; a base plate to which the circuit board is fixed; a terminal block including a base end surface which is fixed to an outer surface of the circuit board opposite to the base plate, a tip surface to which an external conductor having an electrical connection with an external object is able to be fixed, and an intermediate portion extending in a direction moving away from a front surface of the circuit board and electrically connecting the base end surface and the tip surface; and a reinforcement portion which is fixed to at least one of the circuit board and the base plate and which is formed to reinforce the terminal block, wherein the intermediate portion of the terminal block includes a receiving surface facing the tip surface side, and wherein the reinforcement portion includes a restriction surface which is formed to face the receiving surface in an extending direction of the intermediate portion to restrict displacement of the terminal block in a direction moving away from the front surface of the circuit board.
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language eng ; fre ; ger
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title POWER MODULE, AND METHOD FOR MANUFACTURING POWER MODULE
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