WIRING BODY, MOUNTING SUBSTRATE, WIRING TRANSFER BOARD WITH WIRING, INTERMEDIATE MATERIAL FOR WIRING BODY, AND MANUFACTURING METHOD FOR WIRING BODY
A wiring body (30) disposed above a substrate (10) including a conductor (11) includes: a via electrode (31) provided in a via hole (21) formed in an insulating layer (20) above the substrate (10) and connected to the conductor (11) through the via hole (21); and wiring (32) provided above the subst...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | NIRENGI, Takayoshi TOJO, Tadashi OISHI, Akihiro AISAKA, Tsutomu MATSUSHITA, Daisuke IWANAGA, Jumpei |
| description | A wiring body (30) disposed above a substrate (10) including a conductor (11) includes: a via electrode (31) provided in a via hole (21) formed in an insulating layer (20) above the substrate (10) and connected to the conductor (11) through the via hole (21); and wiring (32) provided above the substrate (10) with the insulating layer (20) interposed therebetween. The via electrode (31) includes: a seed layer (31a) formed along an inner surface of the insulating layer (20) from above the conductor (11) in the via hole (21); a via electrode body layer (31b) formed to be located above the seed layer (31a) and fill the via hole (21); and an adhesion layer (31c) formed between the seed layer (31a) and the inner surface of the insulating layer (20) in the via hole (21). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4319510A4</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4319510A4</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4319510A43</originalsourceid><addsrcrecordid>eNrjZJgc7hnk6eeu4OTvEqmj4Osf6hcC4gaHOgWHBDmGuOooQBUAeX7Bbq5BQJWOQS5A0RAPqJSOgqdfiGuQr6uLJ1CDgi-QCPJ09FFw8w9SQDHd0c8FKOsX6uboHBIKFvd1DfHwd0FXycPAmpaYU5zKC6W5GRTcXEOcPXRTC_LjU4sLEpNT81JL4l0DTIwNLU0NDRxNjIlQAgChX0D3</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>WIRING BODY, MOUNTING SUBSTRATE, WIRING TRANSFER BOARD WITH WIRING, INTERMEDIATE MATERIAL FOR WIRING BODY, AND MANUFACTURING METHOD FOR WIRING BODY</title><source>esp@cenet</source><creator>NIRENGI, Takayoshi ; TOJO, Tadashi ; OISHI, Akihiro ; AISAKA, Tsutomu ; MATSUSHITA, Daisuke ; IWANAGA, Jumpei</creator><creatorcontrib>NIRENGI, Takayoshi ; TOJO, Tadashi ; OISHI, Akihiro ; AISAKA, Tsutomu ; MATSUSHITA, Daisuke ; IWANAGA, Jumpei</creatorcontrib><description>A wiring body (30) disposed above a substrate (10) including a conductor (11) includes: a via electrode (31) provided in a via hole (21) formed in an insulating layer (20) above the substrate (10) and connected to the conductor (11) through the via hole (21); and wiring (32) provided above the substrate (10) with the insulating layer (20) interposed therebetween. The via electrode (31) includes: a seed layer (31a) formed along an inner surface of the insulating layer (20) from above the conductor (11) in the via hole (21); a via electrode body layer (31b) formed to be located above the seed layer (31a) and fill the via hole (21); and an adhesion layer (31c) formed between the seed layer (31a) and the inner surface of the insulating layer (20) in the via hole (21).</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241002&DB=EPODOC&CC=EP&NR=4319510A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241002&DB=EPODOC&CC=EP&NR=4319510A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NIRENGI, Takayoshi</creatorcontrib><creatorcontrib>TOJO, Tadashi</creatorcontrib><creatorcontrib>OISHI, Akihiro</creatorcontrib><creatorcontrib>AISAKA, Tsutomu</creatorcontrib><creatorcontrib>MATSUSHITA, Daisuke</creatorcontrib><creatorcontrib>IWANAGA, Jumpei</creatorcontrib><title>WIRING BODY, MOUNTING SUBSTRATE, WIRING TRANSFER BOARD WITH WIRING, INTERMEDIATE MATERIAL FOR WIRING BODY, AND MANUFACTURING METHOD FOR WIRING BODY</title><description>A wiring body (30) disposed above a substrate (10) including a conductor (11) includes: a via electrode (31) provided in a via hole (21) formed in an insulating layer (20) above the substrate (10) and connected to the conductor (11) through the via hole (21); and wiring (32) provided above the substrate (10) with the insulating layer (20) interposed therebetween. The via electrode (31) includes: a seed layer (31a) formed along an inner surface of the insulating layer (20) from above the conductor (11) in the via hole (21); a via electrode body layer (31b) formed to be located above the seed layer (31a) and fill the via hole (21); and an adhesion layer (31c) formed between the seed layer (31a) and the inner surface of the insulating layer (20) in the via hole (21).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJgc7hnk6eeu4OTvEqmj4Osf6hcC4gaHOgWHBDmGuOooQBUAeX7Bbq5BQJWOQS5A0RAPqJSOgqdfiGuQr6uLJ1CDgi-QCPJ09FFw8w9SQDHd0c8FKOsX6uboHBIKFvd1DfHwd0FXycPAmpaYU5zKC6W5GRTcXEOcPXRTC_LjU4sLEpNT81JL4l0DTIwNLU0NDRxNjIlQAgChX0D3</recordid><startdate>20241002</startdate><enddate>20241002</enddate><creator>NIRENGI, Takayoshi</creator><creator>TOJO, Tadashi</creator><creator>OISHI, Akihiro</creator><creator>AISAKA, Tsutomu</creator><creator>MATSUSHITA, Daisuke</creator><creator>IWANAGA, Jumpei</creator><scope>EVB</scope></search><sort><creationdate>20241002</creationdate><title>WIRING BODY, MOUNTING SUBSTRATE, WIRING TRANSFER BOARD WITH WIRING, INTERMEDIATE MATERIAL FOR WIRING BODY, AND MANUFACTURING METHOD FOR WIRING BODY</title><author>NIRENGI, Takayoshi ; TOJO, Tadashi ; OISHI, Akihiro ; AISAKA, Tsutomu ; MATSUSHITA, Daisuke ; IWANAGA, Jumpei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4319510A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>NIRENGI, Takayoshi</creatorcontrib><creatorcontrib>TOJO, Tadashi</creatorcontrib><creatorcontrib>OISHI, Akihiro</creatorcontrib><creatorcontrib>AISAKA, Tsutomu</creatorcontrib><creatorcontrib>MATSUSHITA, Daisuke</creatorcontrib><creatorcontrib>IWANAGA, Jumpei</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NIRENGI, Takayoshi</au><au>TOJO, Tadashi</au><au>OISHI, Akihiro</au><au>AISAKA, Tsutomu</au><au>MATSUSHITA, Daisuke</au><au>IWANAGA, Jumpei</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WIRING BODY, MOUNTING SUBSTRATE, WIRING TRANSFER BOARD WITH WIRING, INTERMEDIATE MATERIAL FOR WIRING BODY, AND MANUFACTURING METHOD FOR WIRING BODY</title><date>2024-10-02</date><risdate>2024</risdate><abstract>A wiring body (30) disposed above a substrate (10) including a conductor (11) includes: a via electrode (31) provided in a via hole (21) formed in an insulating layer (20) above the substrate (10) and connected to the conductor (11) through the via hole (21); and wiring (32) provided above the substrate (10) with the insulating layer (20) interposed therebetween. The via electrode (31) includes: a seed layer (31a) formed along an inner surface of the insulating layer (20) from above the conductor (11) in the via hole (21); a via electrode body layer (31b) formed to be located above the seed layer (31a) and fill the via hole (21); and an adhesion layer (31c) formed between the seed layer (31a) and the inner surface of the insulating layer (20) in the via hole (21).</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP4319510A4 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | WIRING BODY, MOUNTING SUBSTRATE, WIRING TRANSFER BOARD WITH WIRING, INTERMEDIATE MATERIAL FOR WIRING BODY, AND MANUFACTURING METHOD FOR WIRING BODY |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T14%3A14%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NIRENGI,%20Takayoshi&rft.date=2024-10-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4319510A4%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |