LASER PROCESSING HEAD AND LASER PROCESSING SYSTEM
Laser processing head (10) includes a bend mirror that bends a second laser beam in a direction intersecting a first laser beam; a dichroic mirror that transmits most of the first laser beam toward a workpiece (W) and reflects most of the second laser beam toward the workpiece; a workpiece-side cond...
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| creator | OGUCHI, Hisayuki TAKAHASHI, Wataru |
| description | Laser processing head (10) includes a bend mirror that bends a second laser beam in a direction intersecting a first laser beam; a dichroic mirror that transmits most of the first laser beam toward a workpiece (W) and reflects most of the second laser beam toward the workpiece; a workpiece-side condensing lens that condenses each laser beam to irradiate the workpiece with each laser beam; an image sensor that receives a rest of the first laser beam reflected by the dichroic mirror and a rest of the second laser beam transmitted through the dichroic mirror; a detection-side condensing lens that condenses each laser beam to irradiate the image sensor with the condensed laser beam; and an adjuster that adjusts a workpiece-side condensing state on an image plane on a workpiece side. The image sensor detects a detection-side condensing state on an image plane on an image sensor side. The workpiece-side condensing state is adjusted by the adjuster based on the detection-side condensing state. |
| format | Patent |
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The image sensor detects a detection-side condensing state on an image plane on an image sensor side. The workpiece-side condensing state is adjusted by the adjuster based on the detection-side condensing state.</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD0cQx2DVIICPJ3dg0O9vRzV_BwdXRRcPRzUcCQCY4MDnH15WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BJsaGZuZGJo4mxkQoAQAGTiYu</recordid><startdate>20241016</startdate><enddate>20241016</enddate><creator>OGUCHI, Hisayuki</creator><creator>TAKAHASHI, Wataru</creator><scope>EVB</scope></search><sort><creationdate>20241016</creationdate><title>LASER PROCESSING HEAD AND LASER PROCESSING SYSTEM</title><author>OGUCHI, Hisayuki ; TAKAHASHI, Wataru</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4316724A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>OGUCHI, Hisayuki</creatorcontrib><creatorcontrib>TAKAHASHI, Wataru</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OGUCHI, Hisayuki</au><au>TAKAHASHI, Wataru</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LASER PROCESSING HEAD AND LASER PROCESSING SYSTEM</title><date>2024-10-16</date><risdate>2024</risdate><abstract>Laser processing head (10) includes a bend mirror that bends a second laser beam in a direction intersecting a first laser beam; a dichroic mirror that transmits most of the first laser beam toward a workpiece (W) and reflects most of the second laser beam toward the workpiece; a workpiece-side condensing lens that condenses each laser beam to irradiate the workpiece with each laser beam; an image sensor that receives a rest of the first laser beam reflected by the dichroic mirror and a rest of the second laser beam transmitted through the dichroic mirror; a detection-side condensing lens that condenses each laser beam to irradiate the image sensor with the condensed laser beam; and an adjuster that adjusts a workpiece-side condensing state on an image plane on a workpiece side. The image sensor detects a detection-side condensing state on an image plane on an image sensor side. The workpiece-side condensing state is adjusted by the adjuster based on the detection-side condensing state.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | LASER PROCESSING HEAD AND LASER PROCESSING SYSTEM |
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