THERMAL CONDITIONING CIRCUIT

The invention relates to a thermal conditioning system including a refrigerant circuit having: a main loop including in succession: a compression device, a condenser configured to exchange heat with a first heat transfer fluid, a first expansion device, a first evaporator, a bypass branch including...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	DELAFORGE, Laurent, PORTO, Muriel, PERRIN, Thibaut, EL CHAMMAS, Rody
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BLASTING COMBINED HEATING AND REFRIGERATION SYSTEMS HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING WEAPONS
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Beschreibung
Zusammenfassung:	The invention relates to a thermal conditioning system including a refrigerant circuit having: a main loop including in succession: a compression device, a condenser configured to exchange heat with a first heat transfer fluid, a first expansion device, a first evaporator, a bypass branch including a second expansion device and a second evaporator. The second expansion device is a thermostatic expansion valve configured to vary a flow area for the refrigerant between a minimum flow area and a maximum flow area. The bypass branch includes a flow restriction device configured to limit a flow area for the refrigerant to a value less than the maximum flow area of the second expansion device.