LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING PROCESSED SEMICONDUCTOR SUBSTRATE

A laminate includes:a semiconductor substrate;a light-transmissive support substrate; andan adhesive layer and a release layer disposed between the semiconductor substrate and the support substrate.The laminate is used for releasing the semiconductor substrate and the support substrate after the rel...

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Bibliographische Detailangaben
Hauptverfasser:	SHINJO Tetsuya, OGATA Hiroto, OKUNO Takahisa
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A laminate includes:a semiconductor substrate;a light-transmissive support substrate; andan adhesive layer and a release layer disposed between the semiconductor substrate and the support substrate.The laminate is used for releasing the semiconductor substrate and the support substrate after the release layer absorbs light emitted from the support substrate side.The release layer is formed of a release agent composition containing a compound having: a first structure that absorbs the light and contributes to facilitating the semiconductor substrate and the support substrate to be released by absorbing the light; and a siloxane structure as a second structure.