OPEN-CAVITY PACKAGE FOR CHIP SENSOR
In described examples, a device includes an interconnect substrate that has an aperture through the interconnect substrate. An integrated circuit (IC) die that has an on-chip element is mounted on the interconnect substrate with the on-chip element aligned with and facing the aperture. The IC die is...
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| creator | LUEDERS, Michael MUELLNER, Ernst Georg |
| description | In described examples, a device includes an interconnect substrate that has an aperture through the interconnect substrate. An integrated circuit (IC) die that has an on-chip element is mounted on the interconnect substrate with the on-chip element aligned with and facing the aperture. The IC die is over-molded with mold compound only on one side of the interconnect substrate so that the aperture remains free of mold compound to allow the on-chip element to have access to the environment. |
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| language | eng ; fre ; ger |
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| subjects | ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS SEMICONDUCTOR DEVICES TARIFF METERING APPARATUS TESTING |
| title | OPEN-CAVITY PACKAGE FOR CHIP SENSOR |
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