RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED SURFACE OF SUBSTRATE WITH SEMICONDUCTOR ELEMENT MOUNTED THEREON OR SEMICONDUCTOR ELEMENT-FORMING SURFACE OF WAFER WITH SEMICONDUCTOR ELEMENT FORMED THEREON, AND USE THEREOF

Provided is an encapsulation resin composition that is suitable for encapsulating a semiconductor element-mounted surface of a substrate with a semiconductor element(s) mounted thereon or a semiconductor element-forming surface of a wafer with a semiconductor element(s) formed thereon, and is superi...

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Bibliographische Detailangaben
Hauptverfasser:	Hagiwara, Kenji, Kawamura, Norifumi, Yokota, Ryuhei, Osada, Shoichi, Horigome, Hiroki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Provided is an encapsulation resin composition that is suitable for encapsulating a semiconductor element-mounted surface of a substrate with a semiconductor element(s) mounted thereon or a semiconductor element-forming surface of a wafer with a semiconductor element(s) formed thereon, and is superior in low warpage property and grindability. The encapsulation resin composition of the present invention contains:(A) a maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule;(B) a reaction initiator; and(C) an inorganic filler surface-treated with a silane coupling agent,wherein the component (C) has a maximum particle size of not larger than 40 µm.