TRANSPARENT MEMBER, ELECTRONIC DEVICE COMPRISING SAME, AND METHOD FOR THERMOFORMING TRANSPARENT MEMBER

A method of forming a transparent member according to an embodiment may include: a process of putting a first transparent substrate and a second transparent substrate into a first cavity of a lower mold that has a first depth and a second cavity of a lower mold that is connected to the first cavity...

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Hauptverfasser:	AN, Sangung, KIM, Juree, KIM, Junseok, LEE, Hosoon, CHOI, Hyunsuk, JANG, Jongcheol
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY GLASS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TELEPHONIC COMMUNICATION TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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creator	AN, Sangung KIM, Juree KIM, Junseok LEE, Hosoon CHOI, Hyunsuk JANG, Jongcheol
description	A method of forming a transparent member according to an embodiment may include: a process of putting a first transparent substrate and a second transparent substrate into a first cavity of a lower mold that has a first depth and a second cavity of a lower mold that is connected to the first cavity and has a second depth, respectively; a process of disposing an upper mold, which corresponds to the lower mold and includes a pressing portion having at least one pressing surface, on an upper portion of the lower mold; a process of preheating at least one of the lower mold in which the transparent substrates are disposed or the upper mold to a predetermined temperature; and a process of thermoforming the preheated transparent substrates by pressing the preheated transparent substrates in a manner of pressing the upper mold. Various other embodiments identified through the specification are possible.
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Various other embodiments identified through the specification are possible.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>CHEMISTRY</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRICITY</subject><subject>GLASS</subject><subject>MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>PERFORMING OPERATIONS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TELEPHONIC COMMUNICATION</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzLEKwjAQxvEsDqK-wz1AXWwV15hcTcBLwuVwLUXSSbRQ3x8ruLk4ff_hx7dUg7AOOWnGIEBIJ-QK8IJGOAZvwOLVGwQTKbHPPpwha8IKdLAzFxcttJFBHDLFuehDfj_XajH096lsvrtS0KIYty3jsyvT2N_Ko7w6TM3ueKibvW7qP8gbYJo03A</recordid><startdate>20240731</startdate><enddate>20240731</enddate><creator>AN, Sangung</creator><creator>KIM, Juree</creator><creator>KIM, Junseok</creator><creator>LEE, Hosoon</creator><creator>CHOI, Hyunsuk</creator><creator>JANG, Jongcheol</creator><scope>EVB</scope></search><sort><creationdate>20240731</creationdate><title>TRANSPARENT MEMBER, ELECTRONIC DEVICE COMPRISING SAME, AND METHOD FOR THERMOFORMING TRANSPARENT MEMBER</title><author>AN, Sangung ; KIM, Juree ; KIM, Junseok ; LEE, Hosoon ; CHOI, Hyunsuk ; JANG, Jongcheol</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4286345A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>CHEMISTRY</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRICITY</topic><topic>GLASS</topic><topic>MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>PERFORMING OPERATIONS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TELEPHONIC COMMUNICATION</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>AN, Sangung</creatorcontrib><creatorcontrib>KIM, Juree</creatorcontrib><creatorcontrib>KIM, Junseok</creatorcontrib><creatorcontrib>LEE, Hosoon</creatorcontrib><creatorcontrib>CHOI, Hyunsuk</creatorcontrib><creatorcontrib>JANG, Jongcheol</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AN, Sangung</au><au>KIM, Juree</au><au>KIM, Junseok</au><au>LEE, Hosoon</au><au>CHOI, Hyunsuk</au><au>JANG, Jongcheol</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TRANSPARENT MEMBER, ELECTRONIC DEVICE COMPRISING SAME, AND METHOD FOR THERMOFORMING TRANSPARENT MEMBER</title><date>2024-07-31</date><risdate>2024</risdate><abstract>A method of forming a transparent member according to an embodiment may include: a process of putting a first transparent substrate and a second transparent substrate into a first cavity of a lower mold that has a first depth and a second cavity of a lower mold that is connected to the first cavity and has a second depth, respectively; a process of disposing an upper mold, which corresponds to the lower mold and includes a pressing portion having at least one pressing surface, on an upper portion of the lower mold; a process of preheating at least one of the lower mold in which the transparent substrates are disposed or the upper mold to a predetermined temperature; and a process of thermoforming the preheated transparent substrates by pressing the preheated transparent substrates in a manner of pressing the upper mold. Various other embodiments identified through the specification are possible.</abstract><oa>free_for_read</oa></addata></record>
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language	eng ; fre ; ger
recordid	cdi_epo_espacenet_EP4286345A4
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subjects	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY GLASS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TELEPHONIC COMMUNICATION TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
title	TRANSPARENT MEMBER, ELECTRONIC DEVICE COMPRISING SAME, AND METHOD FOR THERMOFORMING TRANSPARENT MEMBER
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