SOLDER PASTE AND BONDED STRUCTURE
A solder paste including at least two types of solder powders each containing at least two types of metal elements has an average free energy of oxide formation of the at least two types of solder powders on a molar basis of -490 kJ/mol or more, the average free energy of oxide formation being a sum...
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| creator | OHASHI, Naomichi MATSUNO, Koso OKAWA, Yasuhiro |
| description | A solder paste including at least two types of solder powders each containing at least two types of metal elements has an average free energy of oxide formation of the at least two types of solder powders on a molar basis of -490 kJ/mol or more, the average free energy of oxide formation being a sum of products (Ai × Bi) of a molar ratio (Ai) of each of the at least two types of metal elements (i) based on all the at least two types of metal elements constituting the at least two types of solder powders included in the solder paste and a free energy (B; kJ/mol) of oxide formation of the each of the at least two types of metal elements, and an average melting point of the at least two types of solder powders on a mass basis of 121°C or lower, the average melting point being a sum of products (Cj × Dj) of a mass ratio (Cj) of each of the at least two types of solder powders (j) based on a total mass of the at least two types of solder powders included in the solder paste and a melting point (Dj°C) of the each of the at least two types of solder powders. |
| format | Patent |
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kJ/mol) of oxide formation of the each of the at least two types of metal elements, and an average melting point of the at least two types of solder powders on a mass basis of 121°C or lower, the average melting point being a sum of products (Cj × Dj) of a mass ratio (Cj) of each of the at least two types of solder powders (j) based on a total mass of the at least two types of solder powders included in the solder paste and a melting point (Dj°C) of the each of the at least two types of solder powders.</description><language>eng ; fre ; ger</language><subject>ALLOYS ; CASTING ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; FERROUS OR NON-FERROUS ALLOYS ; MACHINE TOOLS ; MAKING METALLIC POWDER ; MANUFACTURE OF ARTICLES FROM METALLIC POWDER ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; PERFORMING OPERATIONS ; POWDER METALLURGY ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; TREATMENT OF ALLOYS OR NON-FERROUS METALS ; 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kJ/mol) of oxide formation of the each of the at least two types of metal elements, and an average melting point of the at least two types of solder powders on a mass basis of 121°C or lower, the average melting point being a sum of products (Cj × Dj) of a mass ratio (Cj) of each of the at least two types of solder powders (j) based on a total mass of the at least two types of solder powders included in the solder paste and a melting point (Dj°C) of the each of the at least two types of solder powders.</description><subject>ALLOYS</subject><subject>CASTING</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>MACHINE TOOLS</subject><subject>MAKING METALLIC POWDER</subject><subject>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>POWDER METALLURGY</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><subject>WORKING METALLIC POWDER</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAM9vdxcQ1SCHAMDnFVcPRzUXDy93NxdVEIDgkKdQ4JDXLlYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgEmRuaWZkaGjobGRCgBANBWIcQ</recordid><startdate>20231122</startdate><enddate>20231122</enddate><creator>OHASHI, Naomichi</creator><creator>MATSUNO, Koso</creator><creator>OKAWA, Yasuhiro</creator><scope>EVB</scope></search><sort><creationdate>20231122</creationdate><title>SOLDER PASTE AND BONDED STRUCTURE</title><author>OHASHI, Naomichi ; MATSUNO, Koso ; OKAWA, Yasuhiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4279621A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>ALLOYS</topic><topic>CASTING</topic><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>MACHINE TOOLS</topic><topic>MAKING METALLIC POWDER</topic><topic>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>POWDER METALLURGY</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><topic>WORKING METALLIC POWDER</topic><toplevel>online_resources</toplevel><creatorcontrib>OHASHI, Naomichi</creatorcontrib><creatorcontrib>MATSUNO, Koso</creatorcontrib><creatorcontrib>OKAWA, Yasuhiro</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OHASHI, Naomichi</au><au>MATSUNO, Koso</au><au>OKAWA, Yasuhiro</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SOLDER PASTE AND BONDED STRUCTURE</title><date>2023-11-22</date><risdate>2023</risdate><abstract>A solder paste including at least two types of solder powders each containing at least two types of metal elements has an average free energy of oxide formation of the at least two types of solder powders on a molar basis of -490 kJ/mol or more, the average free energy of oxide formation being a sum of products (Ai × Bi) of a molar ratio (Ai) of each of the at least two types of metal elements (i) based on all the at least two types of metal elements constituting the at least two types of solder powders included in the solder paste and a free energy (B; kJ/mol) of oxide formation of the each of the at least two types of metal elements, and an average melting point of the at least two types of solder powders on a mass basis of 121°C or lower, the average melting point being a sum of products (Cj × Dj) of a mass ratio (Cj) of each of the at least two types of solder powders (j) based on a total mass of the at least two types of solder powders included in the solder paste and a melting point (Dj°C) of the each of the at least two types of solder powders.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | ALLOYS CASTING CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS POWDER METALLURGY SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM WORKING METALLIC POWDER |
| title | SOLDER PASTE AND BONDED STRUCTURE |
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