FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME
An electronic device disclosed herein may comprise: a hinge structure; a flexible display which is folded or unfolded by the hinge structure (for example: the display module 160 of figure1, the display 200 of figure 2); a first portion and a second portion which are close to and each other facing ea...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KANG, Euisung KIM, Hyeonhak RYOO, Kanghyun SEONG, Younghun LEE, Jaehoon BAE, Bumhee |
| description | An electronic device disclosed herein may comprise: a hinge structure; a flexible display which is folded or unfolded by the hinge structure (for example: the display module 160 of figure1, the display 200 of figure 2); a first portion and a second portion which are close to and each other facing each other when folded by the hinge structure, and spaced apart from each other when unfolded; a first circuit board disposed on the first portion; a second circuit board disposed on the second portion; and a flexible circuit board electrically connecting the first printed circuit board and the second circuit board. The flexible printed circuit board may include a first area which bends according to the deformation of the electronic device, and a second region positioned around the first region. The first region may include a single main signal wiring layer. The second portion may include a plurality of signal wiring layers. The first region and the second region may be formed to have different thicknesses. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4274392A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4274392A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4274392A13</originalsourceid><addsrcrecordid>eNrjZHB183GN8HTycVVw9gxyDvUMUXDydwxyUXD0c1Fw8_dxcQRJufq4OocE-ft5Oiu4uIZ5OgMV-_sGBHkGe_q5KwQ7-rryMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjU4oLE5NS81JJ41wATI3MTY0sjR0NjIpQAAAgaK10</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME</title><source>esp@cenet</source><creator>KANG, Euisung ; KIM, Hyeonhak ; RYOO, Kanghyun ; SEONG, Younghun ; LEE, Jaehoon ; BAE, Bumhee</creator><creatorcontrib>KANG, Euisung ; KIM, Hyeonhak ; RYOO, Kanghyun ; SEONG, Younghun ; LEE, Jaehoon ; BAE, Bumhee</creatorcontrib><description>An electronic device disclosed herein may comprise: a hinge structure; a flexible display which is folded or unfolded by the hinge structure (for example: the display module 160 of figure1, the display 200 of figure 2); a first portion and a second portion which are close to and each other facing each other when folded by the hinge structure, and spaced apart from each other when unfolded; a first circuit board disposed on the first portion; a second circuit board disposed on the second portion; and a flexible circuit board electrically connecting the first printed circuit board and the second circuit board. The flexible printed circuit board may include a first area which bends according to the deformation of the electronic device, and a second region positioned around the first region. The first region may include a single main signal wiring layer. The second portion may include a plurality of signal wiring layers. The first region and the second region may be formed to have different thicknesses.</description><language>eng ; fre ; ger</language><subject>CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS ; TELEPHONIC COMMUNICATION</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231108&DB=EPODOC&CC=EP&NR=4274392A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231108&DB=EPODOC&CC=EP&NR=4274392A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KANG, Euisung</creatorcontrib><creatorcontrib>KIM, Hyeonhak</creatorcontrib><creatorcontrib>RYOO, Kanghyun</creatorcontrib><creatorcontrib>SEONG, Younghun</creatorcontrib><creatorcontrib>LEE, Jaehoon</creatorcontrib><creatorcontrib>BAE, Bumhee</creatorcontrib><title>FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME</title><description>An electronic device disclosed herein may comprise: a hinge structure; a flexible display which is folded or unfolded by the hinge structure (for example: the display module 160 of figure1, the display 200 of figure 2); a first portion and a second portion which are close to and each other facing each other when folded by the hinge structure, and spaced apart from each other when unfolded; a first circuit board disposed on the first portion; a second circuit board disposed on the second portion; and a flexible circuit board electrically connecting the first printed circuit board and the second circuit board. The flexible printed circuit board may include a first area which bends according to the deformation of the electronic device, and a second region positioned around the first region. The first region may include a single main signal wiring layer. The second portion may include a plurality of signal wiring layers. The first region and the second region may be formed to have different thicknesses.</description><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>TELEPHONIC COMMUNICATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB183GN8HTycVVw9gxyDvUMUXDydwxyUXD0c1Fw8_dxcQRJufq4OocE-ft5Oiu4uIZ5OgMV-_sGBHkGe_q5KwQ7-rryMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjU4oLE5NS81JJ41wATI3MTY0sjR0NjIpQAAAgaK10</recordid><startdate>20231108</startdate><enddate>20231108</enddate><creator>KANG, Euisung</creator><creator>KIM, Hyeonhak</creator><creator>RYOO, Kanghyun</creator><creator>SEONG, Younghun</creator><creator>LEE, Jaehoon</creator><creator>BAE, Bumhee</creator><scope>EVB</scope></search><sort><creationdate>20231108</creationdate><title>FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME</title><author>KANG, Euisung ; KIM, Hyeonhak ; RYOO, Kanghyun ; SEONG, Younghun ; LEE, Jaehoon ; BAE, Bumhee</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4274392A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>TELEPHONIC COMMUNICATION</topic><toplevel>online_resources</toplevel><creatorcontrib>KANG, Euisung</creatorcontrib><creatorcontrib>KIM, Hyeonhak</creatorcontrib><creatorcontrib>RYOO, Kanghyun</creatorcontrib><creatorcontrib>SEONG, Younghun</creatorcontrib><creatorcontrib>LEE, Jaehoon</creatorcontrib><creatorcontrib>BAE, Bumhee</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KANG, Euisung</au><au>KIM, Hyeonhak</au><au>RYOO, Kanghyun</au><au>SEONG, Younghun</au><au>LEE, Jaehoon</au><au>BAE, Bumhee</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME</title><date>2023-11-08</date><risdate>2023</risdate><abstract>An electronic device disclosed herein may comprise: a hinge structure; a flexible display which is folded or unfolded by the hinge structure (for example: the display module 160 of figure1, the display 200 of figure 2); a first portion and a second portion which are close to and each other facing each other when folded by the hinge structure, and spaced apart from each other when unfolded; a first circuit board disposed on the first portion; a second circuit board disposed on the second portion; and a flexible circuit board electrically connecting the first printed circuit board and the second circuit board. The flexible printed circuit board may include a first area which bends according to the deformation of the electronic device, and a second region positioned around the first region. The first region may include a single main signal wiring layer. The second portion may include a plurality of signal wiring layers. The first region and the second region may be formed to have different thicknesses.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP4274392A1 |
| source | esp@cenet |
| subjects | CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS TELEPHONIC COMMUNICATION |
| title | FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-09T14%3A52%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KANG,%20Euisung&rft.date=2023-11-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4274392A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |