SILYLATED ADHESIVE COMPOSITION WITH IMPROVED ADHESION ON METALLIC SUBSTRATES

1) Moisture curable silylated adhesive composition comprising :- from 20 % to 50 % weight of a silane modified APAO ;- from 2 % to 15 % weight of a filler consisting of expanded hollow thermoplastic polymer microspheres ; and- from 10 % to 60 % weight of a tackifying agent.2) Method for manufacturin...

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Bibliographische Detailangaben
1. Verfasser:	CAO, Yichen
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	1) Moisture curable silylated adhesive composition comprising :- from 20 % to 50 % weight of a silane modified APAO ;- from 2 % to 15 % weight of a filler consisting of expanded hollow thermoplastic polymer microspheres ; and- from 10 % to 60 % weight of a tackifying agent.2) Method for manufacturing an assembly product comprising :- heating at from 130°C to 180°C said composition to make it liquid enough to be applied on a substrate, then- coating said composition on the surface of a primary substrate, then- putting into contact the coated surface of the primary substrate with the surface of a secondary substrate, then- chemically curing the coated composition with water, preferably with atmospheric moisture.