MOLDING COMPOUND THERMAL ENHANCEMENT UTILIZING GRAPHENE OR GRAPHITE MATERIALS

MOLDING COMPOUND THERMAL ENHANCEMENT UTILIZING GRAPHENE OR GRAPHITE MATERIALS

The present disclosure relates to a semiconductor package with a thermally enhanced molding compound. The disclosed semiconductor package includes a module carrier having an upper surface, a die formed over the upper surface of the module carrier, and a thermally enhanced molding compound component...

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Hauptverfasser: BALUT, Brian P, MELIANE, Walid, BOJKOV, Christo, ESSAR, Matthew
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator BALUT, Brian P
MELIANE, Walid
BOJKOV, Christo
ESSAR, Matthew
description The present disclosure relates to a semiconductor package with a thermally enhanced molding compound. The disclosed semiconductor package includes a module carrier having an upper surface, a die formed over the upper surface of the module carrier, and a thermally enhanced molding compound component formed over the upper surface of module carrier to encapsulate the die. Herein, the thermally enhanced molding compound is formed from a molding compound mixed with a thermal additive and has no air pockets or voids. The thermal additive includes a number of carbon flakes or a number of carbon spherical particles. The thermal additive has a thermal conductivity larger than 450 W/m·K and an electrical resistivity larger than 90 µΩ.cm. In one embodiment, the thermal additive includes a number of graphene flakes, a number of graphene particles, a number of graphite flakes, or a number of graphite particles.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title MOLDING COMPOUND THERMAL ENHANCEMENT UTILIZING GRAPHENE OR GRAPHITE MATERIALS
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