INSULATION CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME

According to the embodiment, in an insulating circuit board (1) in which a conductor part (3, 4) is bonded to at least one surface of an insulating substrate (2), when XPS analysis of the carbon amount at the surface of the conductor part (3, 4) is performed, the average value of the carbon amounts...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MORIMOTO, Kazumitsu, HIRABAYASHI, Hideaki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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