ELECTRONIC DEVICE INCLUDING IMPACT RESISTANCE-REINFORCING STRUCTURE
An electronic device including at least one impact resistance-reinforcing structure may be disclosed herein. The disclosed electronic device includes: a first plate disposed to face in a first direction; a second plate disposed to face in a second direction opposite to the first direction; and a hou...
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| creator | KANG, Taehwan NA, Sangsik CHUN, Jungho |
| description | An electronic device including at least one impact resistance-reinforcing structure may be disclosed herein. The disclosed electronic device includes: a first plate disposed to face in a first direction; a second plate disposed to face in a second direction opposite to the first direction; and a housing including a side member disposed so as to surround at least a portion of the space between the first and second plates, wherein the housing may include: a first metal material part; a second metal material part spaced apart from the first metal material part; a first reinforcing structure which is formed in the first metal material part and disposed adjacent to an edge portion of the housing; and a non-metal material part which is a structure integrally injection-molded between the first and second metal material parts and connecting the first and second metal material parts, is large enough to cover the first reinforcing structure, and is adhered to the first reinforcing structure. Various other embodiments are possible. |
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The disclosed electronic device includes: a first plate disposed to face in a first direction; a second plate disposed to face in a second direction opposite to the first direction; and a housing including a side member disposed so as to surround at least a portion of the space between the first and second plates, wherein the housing may include: a first metal material part; a second metal material part spaced apart from the first metal material part; a first reinforcing structure which is formed in the first metal material part and disposed adjacent to an edge portion of the housing; and a non-metal material part which is a structure integrally injection-molded between the first and second metal material parts and connecting the first and second metal material parts, is large enough to cover the first reinforcing structure, and is adhered to the first reinforcing structure. Various other embodiments are possible.</description><language>eng ; fre ; ger</language><subject>CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRICITY ; PHYSICS ; TELEPHONIC COMMUNICATION</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240612&DB=EPODOC&CC=EP&NR=4266657A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240612&DB=EPODOC&CC=EP&NR=4266657A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KANG, Taehwan</creatorcontrib><creatorcontrib>NA, Sangsik</creatorcontrib><creatorcontrib>CHUN, Jungho</creatorcontrib><title>ELECTRONIC DEVICE INCLUDING IMPACT RESISTANCE-REINFORCING STRUCTURE</title><description>An electronic device including at least one impact resistance-reinforcing structure may be disclosed herein. The disclosed electronic device includes: a first plate disposed to face in a first direction; a second plate disposed to face in a second direction opposite to the first direction; and a housing including a side member disposed so as to surround at least a portion of the space between the first and second plates, wherein the housing may include: a first metal material part; a second metal material part spaced apart from the first metal material part; a first reinforcing structure which is formed in the first metal material part and disposed adjacent to an edge portion of the housing; and a non-metal material part which is a structure integrally injection-molded between the first and second metal material parts and connecting the first and second metal material parts, is large enough to cover the first reinforcing structure, and is adhered to the first reinforcing structure. Various other embodiments are possible.</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRICITY</subject><subject>PHYSICS</subject><subject>TELEPHONIC COMMUNICATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB29XF1Dgny9_N0VnBxDfN0dlXw9HP2CXXx9HNX8PQNcHQOUQhyDfYMDnH0c3bVDXL19HPzD3IGyQaHBIU6h4QGufIwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NTigsTk1LzUknjXABMjMzMzU3NHE2MilAAAA_ormA</recordid><startdate>20240612</startdate><enddate>20240612</enddate><creator>KANG, Taehwan</creator><creator>NA, Sangsik</creator><creator>CHUN, Jungho</creator><scope>EVB</scope></search><sort><creationdate>20240612</creationdate><title>ELECTRONIC DEVICE INCLUDING IMPACT RESISTANCE-REINFORCING STRUCTURE</title><author>KANG, Taehwan ; NA, Sangsik ; CHUN, Jungho</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4266657A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRICITY</topic><topic>PHYSICS</topic><topic>TELEPHONIC COMMUNICATION</topic><toplevel>online_resources</toplevel><creatorcontrib>KANG, Taehwan</creatorcontrib><creatorcontrib>NA, Sangsik</creatorcontrib><creatorcontrib>CHUN, Jungho</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KANG, Taehwan</au><au>NA, Sangsik</au><au>CHUN, Jungho</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC DEVICE INCLUDING IMPACT RESISTANCE-REINFORCING STRUCTURE</title><date>2024-06-12</date><risdate>2024</risdate><abstract>An electronic device including at least one impact resistance-reinforcing structure may be disclosed herein. The disclosed electronic device includes: a first plate disposed to face in a first direction; a second plate disposed to face in a second direction opposite to the first direction; and a housing including a side member disposed so as to surround at least a portion of the space between the first and second plates, wherein the housing may include: a first metal material part; a second metal material part spaced apart from the first metal material part; a first reinforcing structure which is formed in the first metal material part and disposed adjacent to an edge portion of the housing; and a non-metal material part which is a structure integrally injection-molded between the first and second metal material parts and connecting the first and second metal material parts, is large enough to cover the first reinforcing structure, and is adhered to the first reinforcing structure. Various other embodiments are possible.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | CALCULATING COMPUTING COUNTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRICITY PHYSICS TELEPHONIC COMMUNICATION |
| title | ELECTRONIC DEVICE INCLUDING IMPACT RESISTANCE-REINFORCING STRUCTURE |
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