THERMAL ELEMENTS FOR DISASSEMBLY OF NODE-BASED ADHESIVELY BONDED STRUCTURES

Methods and apparatuses for disassembling components are described. An apparatus in accordance with an aspect of the present disclosure comprises a first component including a first adhesive interface, a second component including a second adhesive interface, a joint between the first and second adh...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	LAKSHMAN, Narender Shankar
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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