THERMAL ELEMENTS FOR DISASSEMBLY OF NODE-BASED ADHESIVELY BONDED STRUCTURES

Methods and apparatuses for disassembling components are described. An apparatus in accordance with an aspect of the present disclosure comprises a first component including a first adhesive interface, a second component including a second adhesive interface, a joint between the first and second adh...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	LAKSHMAN, Narender Shankar
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	LAKSHMAN, Narender Shankar
description	Methods and apparatuses for disassembling components are described. An apparatus in accordance with an aspect of the present disclosure comprises a first component including a first adhesive interface, a second component including a second adhesive interface, a joint between the first and second adhesive interfaces, the joint comprising an adhesive bonding to the first adhesive interface and to the second adhesive interface, such that the first component and the second component are joined together, and at least one thermal element in the adhesive, wherein the at least one thermal element is configured to weaken the joint by heating the adhesive when an energy is applied to the thermal element.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4263182A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4263182A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4263182A13</originalsourceid><addsrcrecordid>eNrjZPAO8XAN8nX0UXD1cfV19QsJVnDzD1Jw8Qx2DA529XXyiVTwd1Pw83dx1XVyDHZ1UXB08XAN9gxzBUo4-fu5AEWCQ4JCnUNCg1yDeRhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJvGuAiZGZsaGFkaOhMRFKAD2wLWQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>THERMAL ELEMENTS FOR DISASSEMBLY OF NODE-BASED ADHESIVELY BONDED STRUCTURES</title><source>esp@cenet</source><creator>LAKSHMAN, Narender Shankar</creator><creatorcontrib>LAKSHMAN, Narender Shankar</creatorcontrib><description>Methods and apparatuses for disassembling components are described. An apparatus in accordance with an aspect of the present disclosure comprises a first component including a first adhesive interface, a second component including a second adhesive interface, a joint between the first and second adhesive interfaces, the joint comprising an adhesive bonding to the first adhesive interface and to the second adhesive interface, such that the first component and the second component are joined together, and at least one thermal element in the adhesive, wherein the at least one thermal element is configured to weaken the joint by heating the adhesive when an energy is applied to the thermal element.</description><language>eng ; fre ; ger</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; PERFORMING OPERATIONS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231025&DB=EPODOC&CC=EP&NR=4263182A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231025&DB=EPODOC&CC=EP&NR=4263182A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LAKSHMAN, Narender Shankar</creatorcontrib><title>THERMAL ELEMENTS FOR DISASSEMBLY OF NODE-BASED ADHESIVELY BONDED STRUCTURES</title><description>Methods and apparatuses for disassembling components are described. An apparatus in accordance with an aspect of the present disclosure comprises a first component including a first adhesive interface, a second component including a second adhesive interface, a joint between the first and second adhesive interfaces, the joint comprising an adhesive bonding to the first adhesive interface and to the second adhesive interface, such that the first component and the second component are joined together, and at least one thermal element in the adhesive, wherein the at least one thermal element is configured to weaken the joint by heating the adhesive when an energy is applied to the thermal element.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>PERFORMING OPERATIONS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAO8XAN8nX0UXD1cfV19QsJVnDzD1Jw8Qx2DA529XXyiVTwd1Pw83dx1XVyDHZ1UXB08XAN9gxzBUo4-fu5AEWCQ4JCnUNCg1yDeRhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJvGuAiZGZsaGFkaOhMRFKAD2wLWQ</recordid><startdate>20231025</startdate><enddate>20231025</enddate><creator>LAKSHMAN, Narender Shankar</creator><scope>EVB</scope></search><sort><creationdate>20231025</creationdate><title>THERMAL ELEMENTS FOR DISASSEMBLY OF NODE-BASED ADHESIVELY BONDED STRUCTURES</title><author>LAKSHMAN, Narender Shankar</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4263182A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>PERFORMING OPERATIONS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>LAKSHMAN, Narender Shankar</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LAKSHMAN, Narender Shankar</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THERMAL ELEMENTS FOR DISASSEMBLY OF NODE-BASED ADHESIVELY BONDED STRUCTURES</title><date>2023-10-25</date><risdate>2023</risdate><abstract>Methods and apparatuses for disassembling components are described. An apparatus in accordance with an aspect of the present disclosure comprises a first component including a first adhesive interface, a second component including a second adhesive interface, a joint between the first and second adhesive interfaces, the joint comprising an adhesive bonding to the first adhesive interface and to the second adhesive interface, such that the first component and the second component are joined together, and at least one thermal element in the adhesive, wherein the at least one thermal element is configured to weaken the joint by heating the adhesive when an energy is applied to the thermal element.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng ; fre ; ger
recordid	cdi_epo_espacenet_EP4263182A1
source	esp@cenet
subjects	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
title	THERMAL ELEMENTS FOR DISASSEMBLY OF NODE-BASED ADHESIVELY BONDED STRUCTURES
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-09T16%3A09%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LAKSHMAN,%20Narender%20Shankar&rft.date=2023-10-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4263182A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true