WORKPIECE PROCESSING APPARATUS WITH THERMAL PROCESSING SYSTEMS

A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a rotation system configured to rotate the workpiece support, a gas delivery system configured to flow one o...

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Hauptverfasser: BREMENSDORFER, Rolf, WANSIDLER, Alex, CIBERE, Joseph, HEZLER, Dieter, LEMBESIS, Peter, YANG, Michael, ZUCKER, Martin, SOHN, Manuel
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creator BREMENSDORFER, Rolf
WANSIDLER, Alex
CIBERE, Joseph
HEZLER, Dieter
LEMBESIS, Peter
YANG, Michael
ZUCKER, Martin
SOHN, Manuel
description A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a rotation system configured to rotate the workpiece support, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more gas exhaust ports for removing gas from the processing chamber such that a vacuum pressure can be maintained, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4260363A4</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4260363A4</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4260363A43</originalsourceid><addsrcrecordid>eNrjZLAL9w_yDvB0dXZVCAjyd3YNDvb0c1dwDAhwDHIMCQ1WCPcM8VAI8XAN8nX0QVYRHBkc4uobzMPAmpaYU5zKC6W5GRTcXEOcPXRTC_LjU4sLEpNT81JL4l0DTIzMDIzNjB1NjIlQAgBP4SpY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>WORKPIECE PROCESSING APPARATUS WITH THERMAL PROCESSING SYSTEMS</title><source>esp@cenet</source><creator>BREMENSDORFER, Rolf ; WANSIDLER, Alex ; CIBERE, Joseph ; HEZLER, Dieter ; LEMBESIS, Peter ; YANG, Michael ; ZUCKER, Martin ; SOHN, Manuel</creator><creatorcontrib>BREMENSDORFER, Rolf ; WANSIDLER, Alex ; CIBERE, Joseph ; HEZLER, Dieter ; LEMBESIS, Peter ; YANG, Michael ; ZUCKER, Martin ; SOHN, Manuel</creatorcontrib><description>A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a rotation system configured to rotate the workpiece support, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more gas exhaust ports for removing gas from the processing chamber such that a vacuum pressure can be maintained, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2025</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20250101&amp;DB=EPODOC&amp;CC=EP&amp;NR=4260363A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20250101&amp;DB=EPODOC&amp;CC=EP&amp;NR=4260363A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BREMENSDORFER, Rolf</creatorcontrib><creatorcontrib>WANSIDLER, Alex</creatorcontrib><creatorcontrib>CIBERE, Joseph</creatorcontrib><creatorcontrib>HEZLER, Dieter</creatorcontrib><creatorcontrib>LEMBESIS, Peter</creatorcontrib><creatorcontrib>YANG, Michael</creatorcontrib><creatorcontrib>ZUCKER, Martin</creatorcontrib><creatorcontrib>SOHN, Manuel</creatorcontrib><title>WORKPIECE PROCESSING APPARATUS WITH THERMAL PROCESSING SYSTEMS</title><description>A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a rotation system configured to rotate the workpiece support, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more gas exhaust ports for removing gas from the processing chamber such that a vacuum pressure can be maintained, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2025</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAL9w_yDvB0dXZVCAjyd3YNDvb0c1dwDAhwDHIMCQ1WCPcM8VAI8XAN8nX0QVYRHBkc4uobzMPAmpaYU5zKC6W5GRTcXEOcPXRTC_LjU4sLEpNT81JL4l0DTIzMDIzNjB1NjIlQAgBP4SpY</recordid><startdate>20250101</startdate><enddate>20250101</enddate><creator>BREMENSDORFER, Rolf</creator><creator>WANSIDLER, Alex</creator><creator>CIBERE, Joseph</creator><creator>HEZLER, Dieter</creator><creator>LEMBESIS, Peter</creator><creator>YANG, Michael</creator><creator>ZUCKER, Martin</creator><creator>SOHN, Manuel</creator><scope>EVB</scope></search><sort><creationdate>20250101</creationdate><title>WORKPIECE PROCESSING APPARATUS WITH THERMAL PROCESSING SYSTEMS</title><author>BREMENSDORFER, Rolf ; WANSIDLER, Alex ; CIBERE, Joseph ; HEZLER, Dieter ; LEMBESIS, Peter ; YANG, Michael ; ZUCKER, Martin ; SOHN, Manuel</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4260363A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2025</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>BREMENSDORFER, Rolf</creatorcontrib><creatorcontrib>WANSIDLER, Alex</creatorcontrib><creatorcontrib>CIBERE, Joseph</creatorcontrib><creatorcontrib>HEZLER, Dieter</creatorcontrib><creatorcontrib>LEMBESIS, Peter</creatorcontrib><creatorcontrib>YANG, Michael</creatorcontrib><creatorcontrib>ZUCKER, Martin</creatorcontrib><creatorcontrib>SOHN, Manuel</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BREMENSDORFER, Rolf</au><au>WANSIDLER, Alex</au><au>CIBERE, Joseph</au><au>HEZLER, Dieter</au><au>LEMBESIS, Peter</au><au>YANG, Michael</au><au>ZUCKER, Martin</au><au>SOHN, Manuel</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WORKPIECE PROCESSING APPARATUS WITH THERMAL PROCESSING SYSTEMS</title><date>2025-01-01</date><risdate>2025</risdate><abstract>A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a rotation system configured to rotate the workpiece support, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more gas exhaust ports for removing gas from the processing chamber such that a vacuum pressure can be maintained, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title WORKPIECE PROCESSING APPARATUS WITH THERMAL PROCESSING SYSTEMS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-09T09%3A14%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=BREMENSDORFER,%20Rolf&rft.date=2025-01-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4260363A4%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true